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| Customization: | Available |
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| Application: | Electronic Devices, Lighting, Power Supply, Semiconductors |
| Material: | Al2O3 |
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Thin Ceramic Sheet Precision Cutting Small Holes Laser Drilling Alumina Substrate
Alumina substrates have the main advantages of high temperature resistance, high electrical insulation performance, low dielectric constant and dielectric loss, high thermal conductivity, good chemical stability, and similar thermal expansion coefficient to the components, but the ceramic material itself is hard and brittle.
The traditional drilling or punching method is not ideal for the drilling effect of ceramic substrates. It is often difficult to ensure the accuracy of the aperture and the smoothness of the hole wall, and often causes damage to the substrate. In order to solve this problem, laser drilling technology came into being and became the best choice for ceramic substrate processing.
Laser drilling technology is a non-contact processing method. The high-energy focusing of the laser beam instantly melts the material to form a small and precise hole with controllable aperture and high hole wall finish, thereby ensuring the integrity and functionality of the ceramic substrate.
| Alumina Substrate | ||||
| Item | Unit | 96% Al2O3 | 99.6% Al2O3 | |
| Mechanical Properties | ||||
| Color | / | / | White | Ivory |
| Density | Drainage Method | g/cm3 | ≥3.70 | ≥3.95 |
| Light Reflectivity | 400nm/1mm | % | 94 | 83 |
| Flexural Strength | Three Point Bending | MPa | >350 | >500 |
| Fracture Toughness | Indentation Method | MPa·m1/2 | 3.0 | 3.0 |
| Vickers Hardness | Load 4.9N | GPa | 14 | 16 |
| Young's Modulus | Stretching Method | GPa | 340 | 300 |
| Water Absorption | % | 0 | 0 | |
| Camber | / | Length‰ | T≤0.3: ≤5‰, Others: ≤3‰ | ≤3‰ |
| Thermal Properties | ||||
| Max. Service Temperature (Non-loading) | / | ºC | 1200 | 1400 |
| CTE (Coefficient of Thermal Expansion) |
20-800ºC | 1×10-6/ºC | 7.8 | 7.9 |
| Thermal Conductivity | 25ºC | W/m·K | >24 | >29 |
| Thermal Shock Resistance | 800ºC | ≥10 Times | No Crack | No Crack |
| Specific Heat | 25ºC | J/kg·k | 750 | 780 |
| Electrical Properties | ||||
| Dielectric Constant | 25ºC, 1MHz | / | 9.4 | 9.8 |
| Dielectric Loss Angle | 25ºC, 1MHz | ×10-4 | ≤3 | ≤2 |
| Volume Resistivity | 25ºC | Ω·cm | ≥1014 | ≥1014 |
| Dielectric Strength | DC | KV/mm | ≥15 | ≥15 |
| Alumina Substrate | ||||
| Item | Substrate Thickness (mm) | Standard Tolerance (mm) | Best Tolerance (mm) | Laser Cutting Tolerance (mm) |
| Length and Width Tolerance | / | ±2 | ±0.15 | |
| Thickness Tolerance | T<0.3 | ±0.03 | ±0.01 | |
| 0.30-1.0 | ±0.05 | ±0.01 | ||
| T>1.0 | ±10% | ±0.01 | ||
| Alumina Substrate | |||
| Material | Surface Roughness (μm) | ||
| As Fired | Lapped | Polished | |
| 96% Al2O3 | Ra 0.2-0.75 | Ra 0.3-0.7 | Ra ≤0.05 |
| 99.6% Al2O3 | Ra 0.05-0.15 | Ra 0.1-0.5 | Ra ≤0.05 |
Q1: Can the size be customized?
Most of the alumina substrates are rectangular, square or round in shapes. Our rectangular shapes for as-fired alumina substrates are available up to 500mm×500mm. We offer customized products for special requirements.
Q2: What is the maximum service temperature of the alumina substrates?
Alumina substrates can withstand high temperature of 1200-1400ºC.
Q3: What is the minimum thickness of the alumina substrates?
Our standard thickness: 0.25mm, 0.30mm, 0.38mm, 0.50mm, 0.635mm, 0.76mm, 0.80mm, 0.89mm, 1.0mm, 1.5mm and 2.0mm. Minimum thickness to be 0.1mm. Welcome to inquire about customized services.
Q4: What is the depth of the laser scribing?
The depth of the laser scribing of our ceramic substrate is about 35%-65% of the substrate thickness. The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.
Q5: Can alumina substrates be polished?
Yes, lapping and polishing will provide the desired flatness and thickness tolerance, with a surface roughness generally below Ra0.05.
Q6: What is the camber of the alumina substrates?
Our alumina substrates are 100% inspected for camber. The camber is less than 5‰ for 96% alumina with a thickness below 0.3mm. For 96% alumina with other thicknesses and for other purities, the camber is less than 3‰.
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