| Customization: | Available |
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| Application: | Electronics |
| Material: | 96% / 99.6% Alumina Ceramic |
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Thin Ceramic Sheet Precision Cutting Small Holes Laser Drilling Alumina Substrate
Alumina ceramic substrates have the main advantages of high temperature resistance, high electrical insulation performance, low dielectric constant and dielectric loss, high thermal conductivity, good chemical stability, and similar thermal expansion coefficient to the components, but the ceramic material itself is hard and brittle.
The traditional drilling or punching method is not ideal for the drilling effect of ceramic substrates. It is often difficult to ensure the accuracy of the aperture and the smoothness of the hole wall, and often causes damage to the substrate. In order to solve this problem, laser drilling technology came into being and became the best choice for ceramic substrate processing.
Laser drilling technology is a non-contact processing method. The high-energy focusing of the laser beam instantly melts the material to form a small and precise hole with controllable aperture and high hole wall finish, thereby ensuring the integrity and functionality of the ceramic substrate.
| Alumina Ceramic Substrate | ||||
| Item | Unit | 96% Al2O3 | 99.6% Al2O3 | |
| Mechanical Properties | ||||
| Color | / | / | White | Ivory |
| Density | Drainage Method | g/cm3 | ≥3.70 | ≥3.95 |
| Light Reflectivity | 400nm/1mm | % | 94 | 83 |
| Flexural Strength | Three Point Bending | MPa | >350 | >500 |
| Fracture Toughness | Indentation Method | MPa·m1/2 | 3.0 | 3.0 |
| Vickers Hardness | Load 4.9N | GPa | 14 | 16 |
| Young's Modulus | Stretching Method | GPa | 340 | 300 |
| Water Absorption | % | 0 | 0 | |
| Camber | / | Length‰ | T≤0.3: ≤5‰, Others: ≤3‰ | ≤3‰ |
| Thermal Properties | ||||
| Max. Service Temperature (Non-loading) | / | ºC | 1200 | 1400 |
| CTE (Coefficient of Thermal Expansion) |
20-800ºC | 1×10-6/ºC | 7.8 | 7.9 |
| Thermal Conductivity | 25ºC | W/m·K | >24 | >29 |
| Thermal Shock Resistance | 800ºC | ≥10 Times | No Crack | No Crack |
| Specific Heat | 25ºC | J/kg·k | 750 | 780 |
| Electrical Properties | ||||
| Dielectric Constant | 25ºC, 1MHz | / | 9.4 | 9.8 |
| Dielectric Loss Angle | 25ºC, 1MHz | ×10-4 | ≤3 | ≤2 |
| Volume Resistivity | 25ºC | Ω·cm | ≥1014 | ≥1014 |
| Dielectric Strength | DC | KV/mm | ≥15 | ≥15 |
1. Product Tolerances
| Alumina Ceramic Substrate | ||||
| Item | Substrate Thickness (mm) | Standard Tolerance (mm) | Best Tolerance (mm) | Laser Cutting Tolerance (mm) |
| Length and Width Tolerance | / | ±2 | ±0.15 | |
| Thickness Tolerance | T<0.3 | ±0.03 | ±0.01 | |
| 0.30-1.0 | ±0.05 | ±0.01 | ||
| T>1.0 | ±10% | ±0.01 | ||
| Alumina Ceramic Substrate | |||
| Material | Surface Roughness (μm) | ||
| As Fired | Lapped | Polished | |
| 96% Al2O3 | Ra 0.2-0.75 | Ra 0.3-0.7 | Ra ≤0.05 |
| 99.6% Al2O3 | Ra 0.05-0.15 | Ra 0.1-0.5 | Ra ≤0.05 |
Q1: Can the Size be Customized?
Yes, most of the alumina ceramic substrates are rectangular, square or round in shapes. Our rectangular shapes for as-fired alumina ceramic substrates are available up to 500mm×500mm. We offer customized products for special requirements.
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