| Customization: | Available |
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| Application: | Electronic Devices, Lighting, Power Supply, Semiconductors |
| Material: | Al2O3 |
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There are many metallization methods on the surface of ceramic substrates and now we would like to introduce you to the Mo-Mn method. In the field of ceramic substrate metallization, the most widely used method is the Mo-Mn (molybdenum-manganese) method. The main advantages of the Mo-Mn method are:
1. The process is mature and stable;
2. High sealing strength, especially suitable for applications under harsh mechanical and climatic conditions;
3. It can be repaired many times without damaging the metallization layer;
4. The requirements for solder, metallization paste formula and sintering atmosphere are not very strict, and the process is easy to master.
The following is the general process of the Mo-Mn method applied to the surface of the ceramic substrate.
Jinghui is a professional manufacturer of metallized ceramic substrates. It is our goal to provide ideal solutions for customers' different application
requirements. Whether it is cost or engineering solutions, our goal is to find the most economical and suitable solution for our customers!
In order to ensure the best performance of our ceramic circuit boards, all products have to pass strict inspection before they go out.
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