| Customization: | Available |
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| Application: | Industrial Applications |
| Function: | Corrosion Preventive, Thermal Insulation and Sound Insulation |
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The main features of Si3N4 ceramic wafers and substrate
1. High thermal conductivity ( up to 70 W/m.k), 3 times that of alumina ceramic substrate;
2. The thermal expansion coefficient (3.1×10-6/ºC) matches the semiconductor silicon material (3.5-4.0×10-6/ºC);
3. The bending strength is higher than that of the alumina substrate, which is twice that of the alumina substrate;
4. Excellent electrical performance, with extremely high insulation resistance and low dielectric loss;
5. The compatibility of circuit materials is good, and multi-layer wiring can be performed to achieve miniaturization of the package;
6. High thermal shock resistance, from 0 ºC to 200 ºC and then cool down, repeat 10000 times;
7. Chemical resistance, resistant oxidization, acid, alkali corrosion, service life-span up to 10 years
The description of Si3N4 ceramic wafers and substrate
Silicon nitride (Si3N4) is a man-made compound synthesized through several different chemical reaction methods. Parts are pressed and sintered by well-developed methods to produce a ceramic with a unique set of outstanding properties. The material is dark gray to black in color and can be polished to a very smooth reflective surface, giving parts with a striking appearance.
Silicon nitride exceeds other ceramic materials in thermal shock resistance. It also offers an excellent combination of low density, high strength, low thermal expansion, and good corrosion resistance and fracture toughness.
silicon nitride has been used in a number of industrial applications, such as engine components, bearings, and cutting tools.
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Remark:
We produce a selection of ceramic wafers in different materials, customized designs, including alumina ceramic wafers, zirconia ceramic wafers, silicon nitride ceramic wafers, and silicon carbide wafers.
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