High Thermal Conductivity Ultra Thin Aln Ceramic Substrate Aluminum Nitride Plate
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Product Details
| Customization: | Available |
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| Application: | Electronic Devices, Lighting, Power Supply, Semiconductors |
| Material: | AlN |
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1st Bldg, No. 6352, Pingshan Ave., Shatian Community, Kengzi, Pingshan, Shenzhen, ...
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Basic Info.
- Model NO.
- Customized
- Forming Method
- Tape Casting
- Features
- High Thermal Conductivity, Cte Matching Si
- Usage
- Blank Ceramic Circuit Board
- Optional Color
- Gray, Ivory
- Density
- Over 3.33G/Cm3
- Thickness Tolerance
- ±0.03 (Standard) / ±0.01 (Best)
- Length and Width Tolerance
- ±2mm
- Transport Package
- Individual Package
- Specification
- Standard Size: 50.8mm x 50.8mm, Or Customized
- Trademark
- JingHui
- Origin
- China
- HS Code
- 6914100000
- Production Capacity
- 50000 Pieces/Month
Packaging & Delivery
- Package Size
- 27.00cm * 17.00cm * 20.00cm
- Package Gross Weight
- 2.000kg
Product Description
High Thermal Conductivity Ultra Thin AlN Ceramic Substrate Aluminum Nitride Plate
Q2: Do the bare ceramic substrates meet the requirements for metallized ceramic circuit boards?
Yes. Metalized ceramic substrates, also known as metalized ceramic circuit boards, include bare ceramic substrates and metal circuit layers. Bare ceramic substrates are widely used in integrated circuit packaging, LED lighting, heat dissipation substrates, and other fields in the electronic industry due to their advantages of thinness, high-temperature resistance, high electrical insulation performance, low dielectric loss, and good chemical stability.
Q3: Can you provide free samples?
Samples of standard sizes are free, and we only charge for shipping. If customization is required, we only collect a sample fee for MOQ.
Q4: How long is the production lead time?
If the product is in stock, we will ship it within 1-2 days. The standard lead time for other orders is 4-6 weeks.
Q5: What is the depth of the laser scribing?
The depth of the laser scribing of our ceramic substrate is about 35%-63% of the substrate thickness. The scribing spot can be in different sizes. Generally, there are small spots 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spots 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.
If your question is not listed here, please contact us for more information.
Why Choose Ceramic Substrates?
Why Choose the Aluminum Nitride Ceramic Substrate?
The aluminum nitride ceramic substrate has excellent thermal conductivity, reliable electrical insulation, low dielectric constant, and dielectric loss, and is ideal for heat dissipation and packaging of LED lighting, large-scale integrated circuits, semiconductor modules circuits, and high-power devices.
Through the table below, you can see some performance comparisons between aluminum nitride (AlN) ceramic substrates and alumina (Al2O3) ceramic substrates.
| Properties | Unit | AlN | 96% Al2O3 |
| Density | g/cm³ | ≥3.33 | ≥3.70 |
| Flexural Strength | MPa | ≥380 | >350 |
| Max. Service Temperature (Non-loading) | ºC | >1000 | 1200 |
| CTE | 20-800ºC, 10-6/ºC | 4-6 | 7.8 |
| Thermal Conductivity | 20ºC, W/m·K | 170-230 | >24 |
| Dielectric Strength | KV/mm | ≥17 | ≥15 |
We can produce various specifications. The table below shows our standard sizes. The ultra-thin of 0.1mm to 0.2mm AIN Ceramic Substrate will be achieved by lapping.
| AlN Ceramic Substrate | |||||||
| Thickness (mm) | Maximum Size (mm) | Shape | Molding Technique | ||||
| As-fired | Lapped | Polished | Rectangular | Square | Round | ||
| 0.1-0.2 | 50.8 | 50.8 | √ | √ | Tape Casting | ||
| ≥0.2 | 114.3 | 114.3 | √ | √ | Tape Casting | ||
| 0.38 | 140×190 | 140×190 | 120 | √ | √ | Tape Casting | |
| 0.5 | 140×190 | 140×190 | 120 | √ | √ | Tape Casting | |
| 0.635 | 140×190 | 200 | 200 | √ | √ | √ | Tape Casting |
| 1 | 140×190 | 300 | 200 | √ | √ | √ | Tape Casting |
| 1.5 | 300 | 200 | √ | √ | Tape Casting | ||
| 2 | 300 | 200 | √ | √ | Tape Casting | ||
| 2.5 | 300 | √ | √ | Tape Casting | |||
| 3 | 300 | √ | √ | Tape Casting | |||
| … | 450 | √ | √ | Isostatic Pressing | |||
| 10 | 450 | √ | √ | Isostatic Pressing | |||
| Other special thicknesses within the thickness range of 0.1-3.0mm can be achieved by lapping. | |||||||
Besides bare ceramic substrates, we also manufacture metalized ceramic PCBs. Metalized ceramics is one of our advantageous products.
Q1: What is the maximum service temperature of the aluminum nitride ceramic substrates?
Aluminum nitride ceramic substrates can withstand high temperatures over 1000ºC.Q2: Do the bare ceramic substrates meet the requirements for metallized ceramic circuit boards?
Yes. Metalized ceramic substrates, also known as metalized ceramic circuit boards, include bare ceramic substrates and metal circuit layers. Bare ceramic substrates are widely used in integrated circuit packaging, LED lighting, heat dissipation substrates, and other fields in the electronic industry due to their advantages of thinness, high-temperature resistance, high electrical insulation performance, low dielectric loss, and good chemical stability.
Q3: Can you provide free samples?
Samples of standard sizes are free, and we only charge for shipping. If customization is required, we only collect a sample fee for MOQ.
Q4: How long is the production lead time?
If the product is in stock, we will ship it within 1-2 days. The standard lead time for other orders is 4-6 weeks.
Q5: What is the depth of the laser scribing?
The depth of the laser scribing of our ceramic substrate is about 35%-63% of the substrate thickness. The scribing spot can be in different sizes. Generally, there are small spots 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spots 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.
If your question is not listed here, please contact us for more information.
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