High Thermal Conductivity Ultra Thin Aln Ceramic Substrate Aluminum Nitride Plate

Product Description

High Thermal Conductivity Ultra Thin AlN Ceramic Substrate Aluminum Nitride Plate

Product Features

Why Choose Ceramic Substrates?


Why Choose the Aluminum Nitride Ceramic Substrate?

The aluminum nitride ceramic substrate has excellent thermal conductivity, reliable electrical insulation, low dielectric constant, and dielectric loss, and is ideal for heat dissipation and packaging of LED lighting, large-scale integrated circuits, semiconductor modules circuits, and high-power devices.

Through the table below, you can see some performance comparisons between aluminum nitride (AlN) ceramic substrates and alumina (Al2O3) ceramic substrates.

Properties	Unit	AlN	96% Al2O3
Density	g/cm³	≥3.33	≥3.70
Flexural Strength	MPa	≥380	>350
Max. Service Temperature (Non-loading)	ºC	>1000	1200
CTE	20-800ºC, 10^-6/ºC	4-6	7.8
Thermal Conductivity	20ºC, W/m·K	170-230	>24
Dielectric Strength	KV/mm	≥17	≥15

 

Manufacturing Capacity

We can produce various specifications. The table below shows our standard sizes. The ultra-thin of 0.1mm to 0.2mm AIN Ceramic Substrate will be achieved by lapping.
 

AlN Ceramic Substrate
Thickness (mm)	Maximum Size (mm)			Shape			Molding Technique
	As-fired	Lapped	Polished	Rectangular	Square	Round
0.1-0.2		50.8	50.8		√	√	Tape Casting
≥0.2		114.3	114.3		√	√	Tape Casting
0.38	140×190	140×190	120	√	√		Tape Casting
0.5	140×190	140×190	120	√	√		Tape Casting
0.635	140×190	200	200	√	√	√	Tape Casting
1	140×190	300	200	√	√	√	Tape Casting
1.5		300	200		√	√	Tape Casting
2		300	200		√	√	Tape Casting
2.5		300			√	√	Tape Casting
3		300			√	√	Tape Casting
…		450			√	√	Isostatic Pressing
10		450			√	√	Isostatic Pressing
Other special thicknesses within the thickness range of 0.1-3.0mm can be achieved by lapping.

 

We also produce

Besides bare ceramic substrates, we also manufacture metalized ceramic PCBs. Metalized ceramics is one of our advantageous products.

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FAQ

Q1: What is the maximum service temperature of the aluminum nitride ceramic substrates?

Aluminum nitride ceramic substrates can withstand high temperatures over 1000ºC.

Q2: Do the bare ceramic substrates meet the requirements for metallized ceramic circuit boards?
Yes. Metalized ceramic substrates, also known as metalized ceramic circuit boards, include bare ceramic substrates and metal circuit layers. Bare ceramic substrates are widely used in integrated circuit packaging, LED lighting, heat dissipation substrates, and other fields in the electronic industry due to their advantages of thinness, high-temperature resistance, high electrical insulation performance, low dielectric loss, and good chemical stability.

Q3: Can you provide free samples?
Samples of standard sizes are free, and we only charge for shipping. If customization is required, we only collect a sample fee for MOQ.

Q4: How long is the production lead time?
If the product is in stock, we will ship it within 1-2 days. The standard lead time for other orders is 4-6 weeks.

Q5: What is the depth of the laser scribing?
The depth of the laser scribing of our ceramic substrate is about 35%-63% of the substrate thickness. The scribing spot can be in different sizes. Generally, there are small spots 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spots 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.

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