Thick Film PCB Circuit Board Tpc Metallized Alumina Ceramic Substrate
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Product Highlights
- High Voltage & Power Capability: Designed for applications requiring high voltage, high current, and high power performance.
- Excellent Heat Resistance: Features reliable performance with superior heat resistance for demanding environments.
- Cost-Effective Manufacturing: Utilizes mature technology for high production efficiency and low manufacturing costs.
- Customizable Production: Offers proofing and mass production services based on user design drawings and requirements.
- Thick Film Technology: Directly coats conductive paste via screen printing and sinters for firm metal-ceramic adhesion.
- Alumina Ceramic Material: Constructed from Al2O3 for stable electrical connections and structural integrity.
- Versatile Applications: Suitable for electronic devices, lighting, power supplies, and semiconductor industries.
- Adjustable Circuit Thickness: Metal layer thickness ranges from microns to tens of microns, adjustable via multiple printing.
Product Attributes
- Customization
- Available
- Application
- Electronic Devices, Lighting, Power Supply, Semiconductors
- Material
- Al2O3
- Model NO.
- Customized
- Production Process
- Thick Film
- Finished Product
- Ceramic Circuit Board
- Feature
- Reliable Performance
- Usage
- to Realize Electrical Connections
- Type
- Ceramic Substrate
- Transport Package
- Vacuum Packaging
- Specification
- According to the Drawing
- Trademark
- JingHui
- Origin
- China
- HS Code
- 8547100000
- Production Capacity
- 50000 PCS/Month
- Package Size
- 36.00cm * 20.00cm * 24.00cm
- Package Gross Weight
- 8.000kg
- Lead Time
-
35 days (1 - 100 Pieces)
To be negotiated ( > 100 Pieces)
Shipping
- Shipping Cost:
- Contact the supplier about freight and estimated delivery time.
Online Trading Protection
- Payment Guarantee
-
Platform-protected payments with refund support for eligible order issues.
- Platform Logistics
- Clearer shipment tracking with platform-supported logistics.
- Inspection Service
- Optional pre-shipment inspection for quality and quantity checks.
- After-Sales & Dispute Handling
- Platform-assisted dispute resolution, including refunds or returns when applicable.
Only orders placed and paid through Made-in-China.com Secured Trading are eligible for payment protection and the corresponding platform services.
Product Images of Thick Film PCB Circuit Board Tpc Metallized Alumina Ceramic Substrate
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Thick Film PCB Circuit Board Tpc Metallized Alumina Ceramic Substrate -
Thick Film PCB Circuit Board Tpc Metallized Alumina Ceramic Substrate -
Thick Film PCB Circuit Board Tpc Metallized Alumina Ceramic Substrate -
Thick Film PCB Circuit Board Tpc Metallized Alumina Ceramic Substrate -
Thick Film PCB Circuit Board Tpc Metallized Alumina Ceramic Substrate -
Thick Film PCB Circuit Board Tpc Metallized Alumina Ceramic Substrate -
Thick Film PCB Circuit Board Tpc Metallized Alumina Ceramic Substrate
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Product Description
Introduction of Thick Printing Ceramic (TPC) Substrate
Thick Printing Ceramic (TPC) Substrate refers to the production process of directly coating the conductive paste on the ceramic substrate by screen printing, and then sintering at high temperature to make the metal layer firmly adhere to the ceramic substrate.
Depending on the viscosity of the metal paste and the mesh size of the screen, the thickness of the metal circuit layer is generally several microns to tens of microns (increasing the thickness of the metal layer can be achieved by multiple screen printing).
Advantage of the TPC Technology
1. Good heat resistance and reliable performance.
2. Mature technology, high production efficiency and low manufacturing cost.
3. Mostly used in occasions with high voltage, high current and high power.
The following is a comparison table of TPC process and other processes.
What are the Technical Difficulties of the TPC Process?
The selection of conductor paste is a key factor to influence the TPC process, which is composed of functional phase (ie metal powder, particle size within 2μm), binding phase (binder) and organic carrier.
1. The binding phase is generally glass frit or metal oxide or a mixture of the two. Its function is to connect ceramics and metals and determine the adhesion of conductor paste to the ceramic substrate, so it is the key to the production of conductor paste.
2. The role of the organic carrier is mainly to disperse the functional phase and the binding phase, while maintaining a certain viscosity of the conductor paste, preparing for the subsequent screen printing, and will gradually volatilize during the sintering process.
3. The functional phase is generally metal powder of Au, Pt, Au/Pt, Au/Pd, Ag, Ag/Pt, Ag/Pd, Cu, Ni, Al and W, among which Ag, Ag/Pd and Cu are mostly common. Metal powder is the core substance in the thick film paste, and after heat treatment, a metal layer is formed on the surface of the ceramic substrate, thereby realizing the surface metallization of the ceramic substrate.
Jinghui has rich experience in manufacturing metallized ceramic substrates, and can carry out proofing or mass production according to product design drawings and requirements given by users. You are welcome to consult us for business.
About the Supplier
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Company Profile
Established in 2008, JingHui Industry Ltd is a professional manufacturer and exporter that integrates the design, development, and production of various ceramic components in zirconia, alumina, silicon nitride, and aluminum nitride.
Our Facility is located in Loudi City, Hunan Province, and the export division is set up in Shenzhen city, with convenient transportation access. All of our products comply with international quality standards, such as ISO9001: 2015, RoHS, REACH, and FDA, and are greatly appreciated in various markets throughout the world.
We have over ten production lines covering raw material preparation, shaping, sintering, post-processing, metalizing and plating, and so on. The export business accounts for around 70% of our annual turnover. Our well-equipped facilities and excellent quality control system throughout all stages of production enable us to guarantee total customer satisfaction. Our high-quality products and outstanding customer service have helped us to build a global sales network in over 60 countries.
Our company offers a variety of technical ceramic products which can meet your multifarious demands. We have adhered to the management principles of "Quality First, Customer Orientation, and Credit-based" since the company's establishment and always do our best to satisfy every potential need of our customers. Our company is sincerely willing to cooperate with esteemed enterprises worldwide to realize a win-win situation since the trend of economic globalization has developed with irresistible force.
About Our Factory & Business Background
- Address
- 1st Bldg, No. 6352, Pingshan Ave., Shatian Community, Kengzi, Pingshan, Shenzhen, Guangdong, China
- Terms of Payment
- LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram, RMB
- International Commercial Terms(Incoterms)
- FOB, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA, EXW
- Average Lead Time
-
Peak Season Lead Time: 1-3 months
Off Season Lead Time: within 15 workdays - Nearest Port
- Shenzhen, HongKong, Shanghai
Our Production Capability & Technical Expertise
Our Industry Experience & Global Business Record
- Export Year
- 2009-03-11
- Main Markets
- North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
FAQ
- What materials are used in the functional phase of the conductor paste?
- The functional phase typically consists of metal powders such as Au, Pt, Au/Pt, Au/Pd, Ag, Ag/Pt, Ag/Pd, Cu, Ni, Al, and W. Among these, Ag, Ag/Pd, and Cu are the most commonly used.
- How is the thickness of the metal circuit layer controlled?
- The thickness depends on the viscosity of the metal paste and the screen mesh size, generally ranging from several to tens of microns. Increasing the thickness can be achieved by performing multiple screen printing cycles.
- What are the main advantages of TPC technology?
- TPC technology offers good heat resistance, reliable performance, mature technology, high production efficiency, and low manufacturing costs. It is ideal for high voltage, high current, and high power applications.
- Can you provide custom production services?
- Yes, we have rich experience in manufacturing metallized ceramic substrates and can carry out proofing or mass production according to the product design drawings and requirements provided by users.
- What is the role of the organic carrier in the conductor paste?
- The organic carrier disperses the functional and binding phases, maintains the viscosity required for screen printing, and gradually volatilizes during the sintering process.
- What is the function of the binding phase in the conductor paste?
- The binding phase, usually glass frit, metal oxide, or a mixture, connects the ceramics and metals, determining the adhesion of the conductor paste to the ceramic substrate.
- What is the production process for Thick Film PCB Circuit Boards?
- The process involves directly coating conductive paste on the ceramic substrate via screen printing, followed by high-temperature sintering to ensure the metal layer firmly adheres to the substrate.
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