Ultra Thin 0.1mm 0.2mm Al2O3 Sheet Lapped Alumina Ceramic Substrate

• Customization: Available
• Application: Electronic Devices, Lighting, Power Supply, Semiconductors
• Material: Al2O3
• Model NO.: JJBP-0111-0012
• Process: Tape Casting
• Features: Good Thermal Conductivity, Low Dielectric Loss
• Optional Color: White, Ivory, Pink, Black
• Density: Over 3.95g/cm3
• Thickness Tolerance: ±0.03 (Standard) / ±0.01 (Best)
• Length and Width Tolerance: ±2mm
• Customized Service: OEM, ODM, Prototyping, Mass Production
• Transport Package: Individual Packageing
• Trademark: JingHui
• Origin: China
• HS Code: 6914100000
• Production Capacity: 50000 PCS/Month
• Package Size: 27.00cm * 17.00cm * 20.00cm
• Package Gross Weight: 2.000kg

Product Description

Ultra Thin 0.1mm 0.2mm Al2O3 Sheet Lapped Alumina Ceramic Substrate

Product Introduction

 

1. About the Thickness

The thicker the alumina ceramic substrate, the better the strength and the stronger the pressure resistance, but the thermal conductivity is worse than that of the thinner one.

On the contrary, the thinner the substrate, the weaker the strength and pressure resistance than the thicker one, but the thermal conductivity is stronger.

2. About the Material

One of the characteristics of thin-film substrates is that the lines of the circuit are thin and the precision is high.

Because of the "fine lines" that cannot be undulated, thin-film circuits have high requirements for the surface quality of the substrate, so the substrates used for thin-film circuits require high purity (commonly 99.6% alumina).

The substrate with low purity has more glass phases, and the surface roughness is large, while the substrate with higher purity is smoother, denser, and has lower dielectric loss, but the price is also higher.
 

Product Inspection

Packaging & Shipping

Product Parameters

99.6% Alumina Ceramic Substrate
Item	Unit		99.6% Al2O3
Mechanical Properties
Color	/	/	Ivory
Density	Drainage Method	g/cm^3	≥3.95
Light Reflectivity	400nm/1mm	%	83
Flexural Strength	Three Point Bending	MPa	>500
Fracture Toughness	Indentation Method	MPa·m^1/2	3.0
Vickers Hardness	Load 4.9N	GPa	16
Young's Modulus	Stretching Method	GPa	300
Water Absorption		%	0
Camber	/	Length‰	≤3‰
Thermal Properties
Max. Service Temperature (Non-loading)	/	ºC	1400
CTE (Coefficient of Thermal Expansion)	20-800ºC	1×10^-6/ºC	7.9
Thermal Conductivity	25ºC	W/m·K	>29
Thermal Shock Resistance	800ºC	≥10 Times	No Crack
Specific Heat	25ºC	J/kg·k	780
Electrical Properties
Dielectric Constant	25ºC, 1MHz	/	9.8
Dielectric Loss Angle	25ºC, 1MHz	×10^-4	≤2
Volume Resistivity	25ºC	Ω·cm	≥10^14
Dielectric Strength	DC	KV/mm	≥15

Why Choose Us?

Jinghui is dedicated to making high quality products. We do our best to ensure that any substrates supplied by us fully meet your expectations. In order to meet this goal, we provide pre-sales and after-sales services including design guidance, proofing, production, delivery, follow up on the goods quality, etc.