| Customization: | Available |
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| Application: | Electronic Devices, Lighting, Power Supply, Semiconductors |
| Conductive Layer: | Thick Copper Layer |
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What is Direct Bonded Copper Technology?
Direct Bond Copper (DBC) technology is a metallization method of bonding copper foil on the ceramic surface (mainly Al2O3 and AlN). The basic principle is to introduce oxygen element between Cu and ceramic, then form Cu/O eutectic liquid phase at 1065-1083°C, and then react with ceramic substrate and copper foil to form CuAlO2 or Cu(AlO2)2, and realize the bonding between copper foil and substrate under the action of mesophase. 
The ceramic materials used in DBC substrates mainly include Al2O3 and AlN, among which alumina is technically more mature than aluminum nitride, and has an advantage in price, so 80% of DBC substrates on the market use alumina.
The following is a comparison table of DBC process and other processes.
Compared with other processes, DBC process has the following advantages:
1. Strong current-carrying capacity.
2. Good heat resistance and reliable performance.
3. Precise alignment, and no difference in sintering shrinkage.
In order to ensure the best performance of our ceramic circuit boards, all products have to pass strict inspection before they go out.
Jinghui has advanced metallized ceramic substrate production equipment and technology, and can meet customers' R&D process and production needs with fast delivery and stable quality, giving priority to quality and helping customers seize market opportunities.
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