Superior Thermal Management Printed Circuit Board Metallized Alumina Substrate Ceramic PCB

Product Details
Customization: Available
Application: Electronic Devices, Lighting, Power Supply, Semiconductors
Material: Al2O3
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Registered Capital
1000000 RMB
Plant Area
20000 square meters
  • Superior Thermal Management Printed Circuit Board Metallized Alumina Substrate Ceramic PCB
  • Superior Thermal Management Printed Circuit Board Metallized Alumina Substrate Ceramic PCB
  • Superior Thermal Management Printed Circuit Board Metallized Alumina Substrate Ceramic PCB
  • Superior Thermal Management Printed Circuit Board Metallized Alumina Substrate Ceramic PCB
  • Superior Thermal Management Printed Circuit Board Metallized Alumina Substrate Ceramic PCB
  • Superior Thermal Management Printed Circuit Board Metallized Alumina Substrate Ceramic PCB
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  • Overview
  • Product Introduction
  • Product Features
  • Why Choose Us?
Overview

Basic Info.

Model NO.
Customized
Process
Mo-Mn Metallization, Dbc, etc.
Finished Product
Ceramic Circuit Board
Feature
Excellent Electrical and Thermal Properties
Type
Ceramic Substrate
Transport Package
Vacuum Packaging
Specification
According to the Drawing
Trademark
JingHui
Origin
China
HS Code
8547100000
Production Capacity
50000 PCS/Month

Packaging & Delivery

Package Size
36.00cm * 20.00cm * 24.00cm
Package Gross Weight
8.000kg

Product Description

Superior Thermal Management Printed Circuit Board Metallized Alumina Substrate Ceramic PCB

Product Introduction

Ceramic PCB (Ceramic Printed Circuit Board) is an advanced circuit board that uses good thermal conductivity ceramic materials (such as aluminum oxide Al2O3, aluminum nitride AlN, silicon nitride Si3N4, etc.) as substrates. 

Compared with traditional FR4 or metal substrates, ceramic PCBs have excellent thermal conductivity, high temperature resistance, high insulation and chemical stability, and are widely used in high-power electronics, LEDs, automotive electronics, aerospace, 5G communications and other fields.

Product Features

1. Excellent thermal conductivity

The thermal conductivity is as high as 24-320 W/mK (such as AlN can reach 320 W/mK), which is much higher than ordinary PCB materials, effectively solving the heat dissipation problem of high-power devices.

2. High temperature resistance and thermal stability

The operating temperature range is wide (-50ºC to 1000ºC), and the coefficient of thermal expansion (CTE) matches the chip material to reduce failure caused by thermal stress.

3. High insulation and reliability

Ceramic materials have high dielectric strength and excellent insulation performance, suitable for high-voltage environments (such as electric vehicles and power electronics).

4. High-density integration

Supports laser drilling and precision circuit processing, which can realize fine circuits (line width/spacing ≤50μm), suitable for high-frequency and high-speed circuit design.

5. Corrosion resistance and long life

Resistant to chemical corrosion and oxidation, stable performance in harsh environments (such as high humidity, strong acid and alkali), and extended equipment life.

Superior Thermal Management Printed Circuit Board Metallized Alumina Substrate Ceramic PCB
Superior Thermal Management Printed Circuit Board Metallized Alumina Substrate Ceramic PCB
Superior Thermal Management Printed Circuit Board Metallized Alumina Substrate Ceramic PCB

Why Choose Us?

We provide one-stop solutions from design to mass production, supporting:

1. Material selection (Al2O3/AlN)

2. Customized circuits (thick film/thin film process)

3. Surface treatment (nickel plating, gold plating, silver plating, etc.)

4. Fast prototyping and mass production

Superior Thermal Management Printed Circuit Board Metallized Alumina Substrate Ceramic PCB

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