| Customization: | Available |
|---|---|
| Application: | Refractory, Structure Ceramic, Industrial Ceramic, Brazing |
| Material: | Aluminum Nitride |
|
Still deciding? Get samples of US$ 50/Piece
Request Sample
|
Suppliers with verified business licenses
Audited Supplier Audited by an independent third-party inspection agency
The metal paste is coated on the technical ceramic substrate by screen printing, such as aluminum nitride or alumium oxide, then it is sintered at high temperature (the temperature is generally 850°C ~ 900°C) to make the TPC substrate and after drying, refer to the manufacturing flow chart.
Depending on the viscosity of the metal paste and the mesh size of the screen, the thickness of the prepared metal circuit layer is generally 10 μm to 20 μm (increasing the thickness of the metal layer can be achieved by multiple screen printing). The TPC substrate has a simple preparation process, low requirements on processing equipment and environment, and has the advantages of high production efficiency and low manufacturing cost. However, due to the limitations of the screen printing process, TPC substrates cannot obtain high-precision circuits (the minimum line width/space is generally greater than 100 μm).
The category of metal plating on surface mainly including silver, nickle, gold and so on.
| Property | Value | Property | Value |
| Thermal conductivity | 180 W/(m·K) ~260 W/(m·K) | Low CTE | 4×10-6/°C |
| Bending strength | 300 MPa ~ 340 MPa | Elesticity Modules | 310 GPa |
| Permittivity | 8~10 | Insulation breakdown | 15KV |
We not only make rectangular / square type DPC ceramic substrate, but also cirular DPC ceramic COB wafer.
Q1. Are you a factory or trading company?
A: We are a manufacturer with 15 years of OEM, ODM experience for technical ceramic components.
){kind=link}