| Customization: | Available |
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| Application: | Electronic Devices, Lighting, Power Supply, Semiconductors |
| Material: | Al2O3 |
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Why Metallization is Necessary on the Surface of Ceramic Substrates?
The reliability and performance of surface metallization of ceramic substrates have an important impact on the application of ceramic substrates. Strong bonding strength and excellent air tightness are the most basic requirements. Considering the heat dissipation of the substrate, it is also required to have a high thermal conductivity at the interface between the metal and the ceramic.
Metallization methods on the surface of alumina ceramic substrates include: Mo-Mn method, electroless nickel plating method, silver firing method, and Direct Bonded Copper (DBC) method.
What is Mo-Mn Method?
The Mo-Mn method, also known as the high-melting-point metal method, is based on the metallization formula of refractory metal powder Mo, followed by a small amount of low-melting point Mn, adding a binder to coat the ceramic surface, and then sintering to form a metallized layer.
After the metallized layer is fired, in order to improve the wettability between the metallization layer and the solder, a layer of nickel needs to be plated on it.
The following is a schematic diagram of the Mo-Mn Method of the ceramic substrate surface metallization process.
With the continuous development of smart devices in the direction of digitalization, miniaturization, flexibility, low energy consumption, multi-function, and high reliability, ceramic substrate metallization technology has also received extensive attention and rapid development.
Jinghui has rich experience in manufacturing metallized ceramic substrates, and can carry out proofing or mass production according to product design drawings and requirements given by users. You are welcome to consult us for business.
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