Silver Metalized Aln Ceramic PCB Aluminum Nitride Substrate for High-Density Applications

Product Details
Customization: Available
Application: Electronic Devices, Lighting, Power Supply, Semiconductors
Material: AlN
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Registered Capital
1000000 RMB
Plant Area
20000 square meters
  • Silver Metalized Aln Ceramic PCB Aluminum Nitride Substrate for High-Density Applications
  • Silver Metalized Aln Ceramic PCB Aluminum Nitride Substrate for High-Density Applications
  • Silver Metalized Aln Ceramic PCB Aluminum Nitride Substrate for High-Density Applications
  • Silver Metalized Aln Ceramic PCB Aluminum Nitride Substrate for High-Density Applications
  • Silver Metalized Aln Ceramic PCB Aluminum Nitride Substrate for High-Density Applications
  • Silver Metalized Aln Ceramic PCB Aluminum Nitride Substrate for High-Density Applications
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  • Overview
  • Product Introduction
  • Production Process
  • Our Advantages
  • Product Inspection
Overview

Basic Info.

Model NO.
Customized
Type
Ceramic Substrate
Surface Metallization Process
Silver Firing
Usage
to Realize Electrical Connections
Adhesion
Excellent
Solderability
Excellent
Transport Package
Vacuum Packaging
Specification
According to the Drawing
Trademark
JingHui
Origin
China
HS Code
8547100000
Production Capacity
50000 PCS/Month

Packaging & Delivery

Package Size
19.00cm * 10.00cm * 12.00cm
Package Gross Weight
1.500kg

Product Description

Silver Metalized AlN Ceramic PCB Aluminum Nitride Substrate for High-Density Applications

Product Introduction

Silver metalized aluminum nitride substrate combines the high thermal conductivity and excellent electrical insulation properties of aluminum nitride with the enhanced solderability brought by the silver layer.

It is very suitable for high-density applications that require reliable electrical performance, such as power modules, RF devices, LED packaging, automotive electronics, etc.

The role of the silver layer: Improved solderability and corrosion resistance, thereby achieving reliable electrical connections.
Silver Metalized Aln Ceramic PCB Aluminum Nitride Substrate for High-Density Applications

 

Production Process

We use the silver firing method: to infiltrate a layer of metallic silver on the surface of the ceramic substrate. Silver has strong electrical conductivity and good oxidation resistance. The fired silver layer is firmly bonded, the thermal expansion coefficient is close to that of the bare ceramic substrate, and the thermal stability is good. In addition, the firing temperature is low, and the requirements on the atmosphere are not strict, and the firing process is simple and easy.

Silver Metalized Aln Ceramic PCB Aluminum Nitride Substrate for High-Density Applications

Our Advantages

Jinghui is a professional supplier and manufacturer of high-quality metallized ceramic substrates, and has proofing and mass production capabilities. We provide customized solutions to meet specific requirements, ensuring exceptional quality and customer satisfaction.

Silver Metalized Aln Ceramic PCB Aluminum Nitride Substrate for High-Density Applications

Product Inspection

In order to ensure the best performance of our ceramic circuit boards, All products have to pass strict inspection before they go out.

Silver Metalized Aln Ceramic PCB Aluminum Nitride Substrate for High-Density Applications

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