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Mo-Mn Metallized PCB Printed Circuit Board Alumina Ceramic Substrate PCB

SHENZHEN JINGHUI INDUSTRY LIMITED
  • Audited Supplier
  • 7 yrs

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Product Highlights

  • Advanced Metallization Process: Utilizes Mo-Mn method with Ni plating for strong bonding and high reliability.
  • High Alumina Content Options: Available in 96% and 99.6% Alumina substrate materials.
  • Mass Production Capacity: Jinghui offers advanced equipment and verified mass production capabilities.
  • Superior Bonding Strength: Ensures stable packaging performance through strong ceramic-metal bonding.
  • Fast Delivery Options: Off-season lead time within 15 workdays; peak season 1-3 months.
  • Wide Application Range: Suitable for electronic devices, lighting, power supply, and semiconductors.
  • Market Verified Reliability: Products recognized for stability and quality leading the market for years.
  • Flexible Payment Terms: Supports LC, T/T, PayPal, Western Union, and other payment methods.

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Optional pre-shipment inspection for quality and quantity checks.
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Product Images of Mo-Mn Metallized PCB Printed Circuit Board Alumina Ceramic Substrate PCB

Mo-Mn Metallized PCB Printed Circuit Board Alumina Ceramic Substrate PCB
Mo-Mn Metallized PCB Printed Circuit Board Alumina Ceramic Substrate PCB pictures & photos
Mo-Mn Metallized PCB Printed Circuit Board Alumina Ceramic Substrate PCB
Mo-Mn Metallized PCB Printed Circuit Board Alumina Ceramic Substrate PCB pictures & photos
Mo-Mn Metallized PCB Printed Circuit Board Alumina Ceramic Substrate PCB
Mo-Mn Metallized PCB Printed Circuit Board Alumina Ceramic Substrate PCB pictures & photos
Mo-Mn Metallized PCB Printed Circuit Board Alumina Ceramic Substrate PCB
Mo-Mn Metallized PCB Printed Circuit Board Alumina Ceramic Substrate PCB pictures & photos
Mo-Mn Metallized PCB Printed Circuit Board Alumina Ceramic Substrate PCB
Mo-Mn Metallized PCB Printed Circuit Board Alumina Ceramic Substrate PCB pictures & photos
Mo-Mn Metallized PCB Printed Circuit Board Alumina Ceramic Substrate PCB
Mo-Mn Metallized PCB Printed Circuit Board Alumina Ceramic Substrate PCB pictures & photos
Mo-Mn Metallized PCB Printed Circuit Board Alumina Ceramic Substrate PCB
  • Mo-Mn Metallized PCB Printed Circuit Board Alumina Ceramic Substrate PCB
  • Mo-Mn Metallized PCB Printed Circuit Board Alumina Ceramic Substrate PCB
    Mo-Mn Metallized PCB Printed Circuit Board Alumina Ceramic Substrate PCB
  • Mo-Mn Metallized PCB Printed Circuit Board Alumina Ceramic Substrate PCB
    Mo-Mn Metallized PCB Printed Circuit Board Alumina Ceramic Substrate PCB
  • Mo-Mn Metallized PCB Printed Circuit Board Alumina Ceramic Substrate PCB
    Mo-Mn Metallized PCB Printed Circuit Board Alumina Ceramic Substrate PCB
  • Mo-Mn Metallized PCB Printed Circuit Board Alumina Ceramic Substrate PCB
    Mo-Mn Metallized PCB Printed Circuit Board Alumina Ceramic Substrate PCB
  • Mo-Mn Metallized PCB Printed Circuit Board Alumina Ceramic Substrate PCB
    Mo-Mn Metallized PCB Printed Circuit Board Alumina Ceramic Substrate PCB
  • Mo-Mn Metallized PCB Printed Circuit Board Alumina Ceramic Substrate PCB
    Mo-Mn Metallized PCB Printed Circuit Board Alumina Ceramic Substrate PCB

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Product Description

Mo-Mn Metallized PCB Printed Circuit Board Alumina Ceramic Substrate PCB

Our Advantages

Mo-Mn Metallized PCB Printed Circuit Board Alumina Ceramic Substrate PCB
Jinghui has advanced surface treatment process of ceramic substrates and has mass production capacity. Our products have been verified by the market for many years, their reliability and stability have been unanimously recognized by customers, and their quality has reached the leading level in the market.

 

Product Introduction

Why Metallization is Necessary on the Surface of Ceramic Substrates?

We need to realize electrical connections through the ceramic substrate. Therefore, the surface of the ceramic substrate needs to be metallized, and then the surface pattern is completed by the method of image transfer.

Metallization is a crucial part of the production of ceramic substrates, because the wetting ability of metals on ceramic surfaces at high temperatures determines the bonding force between metals and ceramics, which is an important guarantee for the stability of packaging performance.

Therefore, how to implement metallization on the surface of ceramic substrates and improve the bonding force between the two has become the focus of research by many scientists.

Production Process

What is Mo-Mn Method?

The simple mechanism of molybdenum-manganese (Mo-Mn) ceramic metallization is:

Mo powder and Mn powder are used as the main raw materials, and the Mo layer is sintered at high temperature in a reducing atmosphere. Since  the Mo layer is not easily wetted by solder, it is also necessary to plate a layer of nickel on the metallized Mo layer.

Mo-Mn Metallized PCB Printed Circuit Board Alumina Ceramic Substrate PCB

Product Applications

Mo-Mn Metallized PCB Printed Circuit Board Alumina Ceramic Substrate PCB

Why Choose Us?

Jinghui has advanced metallized ceramic substrate production equipment and technology, and can meet customers' R&D process and production needs with fast delivery and stable quality, giving priority to quality and helping customers seize market opportunities.

Mo-Mn Metallized PCB Printed Circuit Board Alumina Ceramic Substrate PCB

About the Supplier

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SHENZHEN JINGHUI INDUSTRY LIMITED
SHENZHEN JINGHUI INDUSTRY LIMITED
SHENZHEN JINGHUI INDUSTRY LIMITED
SHENZHEN JINGHUI INDUSTRY LIMITED
SHENZHEN JINGHUI INDUSTRY LIMITED
SHENZHEN JINGHUI INDUSTRY LIMITED
SHENZHEN JINGHUI INDUSTRY LIMITED
SHENZHEN JINGHUI INDUSTRY LIMITED

About Our Factory & Business Background

Address
1st Bldg, No. 6352, Pingshan Ave., Shatian Community, Kengzi, Pingshan, Shenzhen, Guangdong, China
Terms of Payment
LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram, RMB
International Commercial Terms(Incoterms)
FOB, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA, EXW
Average Lead Time
Peak Season Lead Time: 1-3 months
Off Season Lead Time: within 15 workdays
Nearest Port
Shenzhen, HongKong, Shanghai

Our Production Capability & Technical Expertise

Main Products
Metallized Ceramics, Ceramic Substrates, Pepper Mill Mechanism, Pepper Grinder Mechanism, Ceramic Parts, Precision Ceramics, Zirconia Ceramics, Ceramic Insulators, Silicon Nitride Ceramics, Aluminum Nitride Ceamics

Our Industry Experience & Global Business Record

Export Year
2009-03-11
Main Markets
North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe

FAQ

What materials are used for the substrate?
The substrate is made of Al2O3 (Alumina) with options for 96% or 99.6% purity.
How is the metallization process performed?
It uses the Mo-Mn method where Mo and Mn powders are sintered at high temperature, followed by Ni plating.
What is the lead time for orders?
Off-season lead time is within 15 workdays, while peak season takes 1-3 months.
What are the main applications for this PCB?
It is designed for electronic devices, lighting, power supply systems, and semiconductors.
What payment methods are accepted?
We accept LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram, and RMB.
Why is metallization necessary on ceramic substrates?
Metallization is required to realize electrical connections and ensure strong bonding for stable packaging performance.
What is the minimum order quantity?
The provided text does not specify a minimum order quantity.
Where is the company located?
The company is located in Shenzhen, Guangdong, China.

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