Silver Firing Technology High Purity Alumina Substrate Metalized Ceramic Circuit Board

Product Details
Customization: Available
Application: Electronic Devices, Lighting, Power Supply, Semiconductors
Material: Al2O3
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Registered Capital
1000000 RMB
Plant Area
20000 square meters
  • Silver Firing Technology High Purity Alumina Substrate Metalized Ceramic Circuit Board
  • Silver Firing Technology High Purity Alumina Substrate Metalized Ceramic Circuit Board
  • Silver Firing Technology High Purity Alumina Substrate Metalized Ceramic Circuit Board
  • Silver Firing Technology High Purity Alumina Substrate Metalized Ceramic Circuit Board
  • Silver Firing Technology High Purity Alumina Substrate Metalized Ceramic Circuit Board
  • Silver Firing Technology High Purity Alumina Substrate Metalized Ceramic Circuit Board
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  • Overview
  • Product Introduction
  • Production Process
  • Product Applications
  • Product Inspection
  • Our Advantages
Overview

Basic Info.

Model NO.
Customized
Type
Ceramic Substrate
Substrate Material
96%, 99.6% Alumina
Surface Metallization Process
Silver Firing
Usage
to Realize Electrical Connections
Adhesion
Excellent
Solderability
Excellent
Transport Package
Vacuum Packaging
Specification
According to the Drawing
Trademark
JingHui
Origin
China
HS Code
8547100000
Production Capacity
50000 PCS/Month

Packaging & Delivery

Package Size
30.00cm * 18.00cm * 21.00cm
Package Gross Weight
3.000kg

Product Description

Silver Firing Technology High Purity Alumina Substrate Metalized Ceramic Circuit Board

Product Introduction

The metallized ceramic substrate is a ceramic plate obtained by metallizing the surface of the ceramic substrate by technical means. The ceramic substrate has better electrical function, thermal conductivity and insulation after metallization.

The silver firing method is to infiltrate a layer of metallic silver on the surface of the ceramic substrate. Silver has strong electrical conductivity and good oxidation resistance. The fired silver layer is firmly bonded, the thermal expansion coefficient is close to that of the bare ceramic substrate, and the thermal stability is good. In addition, the firing temperature is low, and the requirements on the atmosphere are not strict, and the firing process is simple and easy.

Production Process

The following is a simple description of the Silver Firing Method of the ceramic substrate.

Silver Firing Technology High Purity Alumina Substrate Metalized Ceramic Circuit Board

Product Applications

Silver Firing Technology High Purity Alumina Substrate Metalized Ceramic Circuit Board

Product Inspection

In order to ensure the best performance of our metallized ceramic substrates, all products have to pass strict inspection before they go out.
Silver Firing Technology High Purity Alumina Substrate Metalized Ceramic Circuit Board

Our Advantages

Jinghui provides customized high-performance metallized ceramic substrates. They are ideal for power modules, RF devices, LED packaging, automotive electronics, and other compact, high-performance electronic applications that require efficient thermal management and electrical insulation.

Silver Firing Technology High Purity Alumina Substrate Metalized Ceramic Circuit Board

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