• Laser Scribing 0.3mm 0.5mm 0.635mm 1mm Thick Alumina Ceramic Substrate
  • Laser Scribing 0.3mm 0.5mm 0.635mm 1mm Thick Alumina Ceramic Substrate
  • Laser Scribing 0.3mm 0.5mm 0.635mm 1mm Thick Alumina Ceramic Substrate
  • Laser Scribing 0.3mm 0.5mm 0.635mm 1mm Thick Alumina Ceramic Substrate
  • Laser Scribing 0.3mm 0.5mm 0.635mm 1mm Thick Alumina Ceramic Substrate
  • Laser Scribing 0.3mm 0.5mm 0.635mm 1mm Thick Alumina Ceramic Substrate

Laser Scribing 0.3mm 0.5mm 0.635mm 1mm Thick Alumina Ceramic Substrate

Application: Refractory, Structure Ceramic, Industrial Ceramic
Type: Ceramic Plates
Product Name: Alumina Ceramic Substrate
Forming Methods: Tape Casting, ISO Pressed, Dry Pressed
Purity of Material: 96%, 99%, 99.5%, 99.9% Alumina
Color: White, Ivory, Pink, Transparent
Samples:
US$ 5/Piece 1 Piece(Min.Order)
| Request Sample
Customization:
Diamond Member Since 2020

Suppliers with verified business licenses

Rating: 5.0/5
Manufacturer/Factory, Trading Company, Group Corporation
  • Overview
  • Product Description
  • The specification
  • Typical Applications
  • We also produce
  • Certifications
  • FAQ
Overview

Basic Info.

Model NO.
Standard
Min. Thickness
0.15mm
Max. Thickness
30mm
Secondary Process
Flat Grinding, Laser Cutting, CNC Machining
Features
High Mechanical Strength, High Insulation
Usage
Work as Circuit Board, Ceramic Lining Plate
Material
Alumina Ceramic
Transport Package
Individual Packaging with Pallet
Specification
Max. 600mm x 500mm
Trademark
JingHui
Origin
China
HS Code
8547100000
Production Capacity
5000000/Month

Product Description

Laser Scribing 0.3mm 0.5mm 0.635mm 1mm Thick Alumina Ceramic Substrate
 

Product Description

Laser Scribing ceramic substrates has been increasingly popular since its introduction to the industry nearly 50 years ago. The process involves pulsing a CO2 laser through an optical configuration, through a focusing lens, focusing the beam through an air assisted nozzle assembly, and finally onto the substrate's work surface. Most Laser scribing systems utilize a CNC or PC based motion control system, moving the substrate below the fixed beam assembly at speeds as fast as 10 in./sec, or faster.


Each pulse of the Laser provides an efficient and effective evacuation of molten and ablated ceramic substrate particulates. Well executed scribes allow for subsequent controlled Breaks, or "Snapping", of the substrate to its final size.

The specification

The Size & tolerance

Hole Diameter (mm) Standard Tolerance (mm)
φ≤0.5 0.08
φ>0.5 0.20

The scribing line specification
Substrate Thickness (mm) the Percentage of
Laser Scribe Line Depth
to Thickness (%)
0.2-0.3 40%±5%
0.3<T≤0.5 50%±3%
0.5<T≤1.0 43%±3%
1.2 55%±3%
1.5 55%±3%
2.0 55%+10%
The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-1.0mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.
 

Typical Applications

Laser Scribing 0.3mm 0.5mm 0.635mm 1mm Thick Alumina Ceramic Substrate

We also produce

Laser Scribing 0.3mm 0.5mm 0.635mm 1mm Thick Alumina Ceramic Substrate
Laser Scribing 0.3mm 0.5mm 0.635mm 1mm Thick Alumina Ceramic Substrate
Laser Scribing 0.3mm 0.5mm 0.635mm 1mm Thick Alumina Ceramic Substrate

Remark:
We not only make high purity alumina ceramic substrates, but also manufacturing aluminum nitride ceramic substrate/wafer, silicon nitride ceramic substrates and zirconia ceramic substrates.
 

Certifications

We are a ISO9001 certificated facility, all processes have been conducting per the quality management system rigoriously.
Laser Scribing 0.3mm 0.5mm 0.635mm 1mm Thick Alumina Ceramic Substrate

FAQ

Q01: What sizes are available for the Alumina substrates?
A: The typical largest size available is 280x240mm. Maximum standard thickness is 1.27mm and up to 2.0mm thicknesses are available per request. We offer customized products for special requirements.

 

Q02.What are the main advantages of a Ceramic PCB?

A: Maximum operating temperatures of the substrates of over 800°C, high Thermal Conductivity of up to 180W/mK, very low CTE (Coefficient of Thermal Expansion), 0% water absorption for Hermetic packages, low signal loss and fine microcircuit applications with the DPC production method.

Q3: What is the via diameter available for Alumina substrates?
A: Round vias with diameters of 0.2mm are available. Square holes and special shape holes are also available per request. Please contact us for details.

Q4:How are the ceramic substrates machined?
A: We use 100% laser processes. This is the best way to ensure precise and clean milling and drilling of the ceramic.

Q5: What other products do you manufacture?
A: Yes, we also produce metalized ceramics, ceramic seals and high precision pump plunger and pistons besides alumina ceramic substrates.

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Diamond Member Since 2020

Suppliers with verified business licenses

Rating: 5.0/5
Manufacturer/Factory, Trading Company, Group Corporation
Registered Capital
1000000 RMB
Plant Area
>2000 square meters