| Customization: | Available |
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| Application: | Electronic Devices, Lighting, Power Supply, Semiconductors |
| Material: | Al2O3 |
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Structure and Composition
1. Ceramic Substrate:
Alumina (Al2O3): low cost, high mechanical strength, good dielectric properties (dielectric constant ~9.8), suitable for most conventional applications.
2. Metallization Layer:
A gold layer is formed on the ceramic surface by thick film printing (such as gold paste), thin film deposition (sputtering/plating) or direct bonding process, with a thickness of usually 0.1~10 μm.
Electrical Properties:
- Low resistance (the resistivity of gold is only 2.44 μΩ·cm), suitable for high-frequency signal transmission.
- High insulation (resistivity of ceramic body>1014Ω·cm), avoiding leakage.
Thermal Management:
- The thermal conductivity of ceramic substrate is much higher than that of organic substrate (such as FR4), and the rapid thermal diffusion of gold can effectively reduce the hot spot temperature.
Reliability:
- High temperature resistance (Al2O3 can withstand 1600ºC sintering), gold layer is anti-oxidation, and has good long-term stability.
- The coefficient of thermal expansion (CTE) matches the chip material (such as Si, GaAs) to reduce thermal stress.
JingHui is a manufacturer of proofing and production of ceramic circuit boards. We have more than 18 years of experience in ceramic substrate production. We can process precision circuits, especially good at DBC technology, silver firing technology, electroless nickel plating technology and Mo-Mn technology. You can consult us for more processing methods of ceramic substrates.
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