| Application: | Structure Ceramic, Industrial Ceramic |
|---|---|
| Type: | Ceramic Plates |
| Finished Product: | Ceramic Circuit Board |
| Substrate Material: | 96%, 99.6% Alumina |
| Surface Metallization Process: | Electroless Nickel Plating Process |
| Feature: | Strong Bonding Strength Between Ceramic and Metal |
| Customization: |
|---|
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Audited Supplier The metallized ceramic substrate is a ceramic plate obtained by metallizing the surface of the ceramic substrate by technical means. The ceramic
substrate has better electrical function, thermal conductivity and insulation after metallization.
There are many metallization methods on the surface of ceramic substrates. Here we focus on the electroless nickel plating method.
What is Electroless Nickel Plating Method?
The electroless nickel plating method uses a reducing agent to reduce the nickel ions in the solution onto the surface of the catalytically active object
to form a Ni coating. The surface roughness of the electroless nickel plating method has a great influence on the adhesion strength of the coating,
and within a certain range, the bonding strength increases with the increase of the surface roughness of the ceramic substrate. Therefore, the key
process of the electroless nickel plating method is to roughen the surface of the ceramic substrate.
The following is the general process of the electroless nickel plating method applied to the surface of the ceramic substrate.
Ceramic substrates have very broad application prospects in high-power LED industry, high-frequency electronic equipment, large-scale network
base stations, filter devices and other fields.
Jinghui has rich experience in manufacturing metallized ceramic substrates, and can carry out proofing or mass production according to product
design drawings and requirements given by users. You are welcome to consult us for business.
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