Electroless Nickel Plating Technology Ni Plated Alumina Ceramic Substrate

Product Details
Customization: Available
Application: Structure Ceramic, Industrial Ceramic
Material: Alumina Ceramic
Manufacturer/Factory, Trading Company, Group Corporation

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Registered Capital
1000000 RMB
Plant Area
20000 square meters
  • Electroless Nickel Plating Technology Ni Plated Alumina Ceramic Substrate
  • Electroless Nickel Plating Technology Ni Plated Alumina Ceramic Substrate
  • Electroless Nickel Plating Technology Ni Plated Alumina Ceramic Substrate
  • Electroless Nickel Plating Technology Ni Plated Alumina Ceramic Substrate
  • Electroless Nickel Plating Technology Ni Plated Alumina Ceramic Substrate
  • Electroless Nickel Plating Technology Ni Plated Alumina Ceramic Substrate
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  • Overview
  • Product Introduction
  • Product Applications
  • Our Advantages
Overview

Basic Info.

Model NO.
Customized
Finished Product
Ceramic Circuit Board
Substrate Material
96%, 99.6% Alumina
Surface Metallization Process
Electroless Nickel Plating Process
Feature
Strong Bonding Strength Between Ceramic and Metal
Usage
to Realize Electrical Connections
Type
Ceramic Plates
Transport Package
Vacuum Packaging
Specification
According to the Drawing
Trademark
JingHui
Origin
China
HS Code
8547100000

Product Description

Electroless Nickel Plating Technology Ni Plated Alumina Ceramic Substrate
Product Introduction

The metallized ceramic substrate is a ceramic plate obtained by metallizing the surface of the ceramic substrate by technical means. The ceramic

substrate has better electrical function, thermal conductivity and insulation after metallization.


There are many metallization methods on the surface of ceramic substrates. Here we focus on the electroless nickel plating method.


What is Electroless Nickel Plating Method?

The electroless nickel plating method uses a reducing agent to reduce the nickel ions in the solution onto the surface of the catalytically active object

to form a Ni coating. The surface roughness of the electroless nickel plating method has a great influence on the adhesion strength of the coating,

and within a certain range, the bonding strength increases with the increase of the surface roughness of the ceramic substrate. Therefore, the key

process of the electroless nickel plating method is to roughen the surface of the ceramic substrate.



The following is the general process of the electroless nickel plating method applied to the surface of the ceramic substrate.

Electroless Nickel Plating Technology Ni Plated Alumina Ceramic Substrate

Product Applications

Ceramic substrates have very broad application prospects in high-power LED industry, high-frequency electronic equipment, large-scale network

base stations, filter devices and other fields.

Electroless Nickel Plating Technology Ni Plated Alumina Ceramic Substrate

Our Advantages

Jinghui has rich experience in manufacturing metallized ceramic substrates, and can carry out proofing or mass production according to product

design drawings and requirements given by users. You are welcome to consult us for business.

Electroless Nickel Plating Technology Ni Plated Alumina Ceramic Substrate
Our products have been verified by the market for many years, their reliability and stability have been unanimously recognized by customers, and

their quality has reached the leading level in the market.

Electroless Nickel Plating Technology Ni Plated Alumina Ceramic Substrate

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