High Purity 96% Aluminum Oxide Substrate Al2O3 Alumina Ceramic Plate
Advanced ceramic plates have outstanding thermal and dielectric properties. These are essential to today's semiconductors industry. Typical ceramic substrates are generally made out of alumina (Al2O3) or aluminum nitride (AlN).
Alumina ceramic is the most common substrate material you'll find in today's printed circuit boards. It boasts an excellent balance of thermal and electrical conductivity when compared to other oxide ceramic substrates.
The alumina ceramic plate is also reputed for better mechanical strength and chemical stability and is readily available. These properties make it the ideal option for technical manufacturing, especially when various shapes have to be considered.
1. Product Specification of 96% Alumina Ceramic Plates
Products of various specifications can be produced. The table below shows our standard thicknesses and sizes.
96% Alumina Ceramic Plate |
Thickness (mm) |
Maximum Size (mm) |
Shape |
Molding Technique |
As Fired |
Lapped |
Polished |
Rectangular |
Square |
Round |
0.25 |
120 |
114.3 |
114.3 |
|
√ |
|
Tape Casting |
0.3 |
120 |
114.3 |
114.3 |
|
√ |
|
Tape Casting |
0.38 |
140×190 |
|
|
√ |
|
|
Tape Casting |
0.5 |
140×190 |
|
|
√ |
|
|
Tape Casting |
0.635 |
140×190 |
|
|
√ |
|
|
Tape Casting |
0.76 |
130×140 |
|
|
√ |
|
|
Tape Casting |
0.8 |
130×140 |
|
|
√ |
|
|
Tape Casting |
0.89 |
130×140 |
|
|
√ |
|
|
Tape Casting |
1 |
280×240 |
|
|
√ |
|
|
Tape Casting |
1.5 |
165×210 |
|
|
√ |
|
|
Tape Casting |
2 |
500×500 |
|
|
√ |
|
|
Tape Casting |
Other special thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping. |
2. Product Tolerances
96% Alumina Ceramic Plate |
Item |
Substrate Thickness (mm) |
Standard Tolerance (mm) |
Best Tolerance (mm) |
Laser Cutting Tolerance (mm) |
Length and Width Tolerance |
/ |
±2 |
|
±0.15 |
Thickness Tolerance |
T<0.3 |
±0.03 |
±0.01 |
|
0.30-1.0 |
±0.05 |
±0.01 |
|
T>1.0 |
±10% |
±0.01 |
|
3. Surface Roughness
96% Alumina Ceramic Plate |
Surface Roughness (μm) |
As Fired |
Lapped |
Polished |
Ra 0.2-0.75 |
Ra 0.3-0.7 |
Ra ≤0.05 |
4. Laser Processing
(1) Hole Size
96% Alumina Ceramic Plate |
Hole Diameter (mm) |
Standard Tolerance (mm) |
φ≤0.5 |
0.08 |
φ>0.5 |
0.2 |
(2) Laser scribing
96% Alumina Ceramic Plate |
Substrate Thickness (mm) |
the Percentage of Laser Scribe Line Depth to Thickness (%) |
0.2-0.3 |
40%±5% |
0.3<T≤0.5 |
50%±3% |
0.5<T≤1.0 |
43%±3% |
1.2 |
55%±3% |
1.5 |
55%±3% |
2.0 |
55%+10% |
The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm. |
96% Alumina Ceramic Plate |
Item |
Unit |
96% Al2O3 |
Mechanical Properties |
Color |
/ |
/ |
White |
Density |
Drainage Method |
g/cm3 |
≥3.70 |
Light Reflectivity |
400nm/1mm |
% |
94 |
Flexural Strength |
Three Point Bending |
MPa |
>350 |
Fracture Toughness |
Indentation Method |
MPa·m1/2 |
3.0 |
Vickers Hardness |
Load 4.9N |
GPa |
14 |
Young's Modulus |
Stretching Method |
GPa |
340 |
Water Absorption |
|
% |
0 |
Camber |
/ |
Length‰ |
T≤0.3: ≤5‰, Others: ≤3‰ |
Thermal Properties |
Max. Service Temperature (Non-loading) |
/ |
ºC |
1200 |
CTE (Coefficient of Thermal Expansion) |
20-800ºC |
1×10-6/ºC |
7.8 |
Thermal Conductivity |
25ºC |
W/m·K |
>24 |
Thermal Shock Resistance |
800ºC |
≥10 Times |
No Crack |
Specific Heat |
25ºC |
J/kg·k |
750 |
Electrical Properties |
Dielectric Constant |
25ºC, 1MHz |
/ |
9.4 |
Dielectric Loss Angle |
25ºC, 1MHz |
×10-4 |
≤3 |
Volume Resistivity |
25ºC |
Ω·cm |
≥1014 |
Dielectric Strength |
DC |
KV/mm |
≥15 |
We offer bare ceramic substrates in various raw materials, sizes, shapes and thicknesses. Welcome to contact us for quotation.