Polished 0.5mm 1mm 2mm Ceramic Plate Silicon Nitride Si3n4 Substrate

Product Details
Customization: Available
Application: High-End Electronics, Semiconductors, Optics, etc.
Function: Insulation and Heat Dissipation Substrate
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Registered Capital
1000000 RMB
Plant Area
20000 square meters
  • Polished 0.5mm 1mm 2mm Ceramic Plate Silicon Nitride Si3n4 Substrate
  • Polished 0.5mm 1mm 2mm Ceramic Plate Silicon Nitride Si3n4 Substrate
  • Polished 0.5mm 1mm 2mm Ceramic Plate Silicon Nitride Si3n4 Substrate
  • Polished 0.5mm 1mm 2mm Ceramic Plate Silicon Nitride Si3n4 Substrate
  • Polished 0.5mm 1mm 2mm Ceramic Plate Silicon Nitride Si3n4 Substrate
  • Polished 0.5mm 1mm 2mm Ceramic Plate Silicon Nitride Si3n4 Substrate
  • Overview
  • Product Description
  • Product Introduction
  • Product Applications
  • Why Choose Us?
  • Certifications
  • Our Partners
Overview

Basic Info.

Model NO.
Customized
Material
Silicon Nitride
Color
Grey
Thickness
From 0.3mm to 1mm Available
Feature
High Thermal Conductivity
Sample
Available
Payment
Negotiation
OEM
Acceptable
Shipping
Express/Air/Sea
Advantage
High Efficiency Low Cost
Type
Ceramic Substrate
Transport Package
Individual Packaging
Specification
Max. OD to be 400mm
Trademark
JingHui
Origin
China
HS Code
8547100000
Production Capacity
50000 PCS/Month

Packaging & Delivery

Package Size
36.00cm * 20.00cm * 24.00cm
Package Gross Weight
8.000kg

Product Description

Polished 0.5mm 1mm 2mm Ceramic Plate Silicon Nitride Si3N4 Substrate

Product Description

Silicon nitride ceramics have become high-end substrate materials due to their excellent comprehensive properties.

Polished 0.5mm 1mm 2mm Ceramic Plate Silicon Nitride Si3n4 Substrate

1. High mechanical strength: high hardness (~15 GPa), excellent bending strength (up to 800 MPa or more).

2. High temperature resistance: can maintain stability above 1200°C.

3. Low thermal expansion coefficient (~3.2×10-6/°C), well matched with semiconductor materials (such as silicon).

4. High thermal conductivity (~30 W/m·K), suitable for heat dissipation of high-power devices.

5. Chemical inertness: corrosion and oxidation resistance, suitable for harsh environments.

Product Introduction

Necessity of polishing process

After sintering, silicon nitride ceramics have microscopic bumps, scratches and subsurface damage layers on their surface, which directly affect:

- The fit of electronic device packaging and signal transmission efficiency.
- Light scattering and reflectivity in optical applications.
- The airtightness and wear resistance of mechanical seals.

Polishing can eliminate surface defects and achieve ultra-high smoothness.

Product Applications

1. Power electronics: Insulation heat dissipation substrate for IGBT and SiC devices.

2. Aerospace: High-temperature sensor carrier.

3. Biomedical: High-wear-resistant parts such as artificial joints.

4. Optics: Laser reflector substrate.

Why Choose Us?

1. 18 Years of manufacturing experience in OEM, ODM, and trusted & professional teams.

2. Powerful R&D, prototyping & mass production capability to support trial order and high volume production.

3. In-house comprehensive manufacturing types of equipment from raw materials to high precision machining.

4. Rigorous quality control system and processes, including IQC, IPQC, QA, OQC in working instructions.

5. Surpassing pre-sales, sales, and after-sales service abide all orders every customer as the first priority.

Polished 0.5mm 1mm 2mm Ceramic Plate Silicon Nitride Si3n4 Substrate
Polished 0.5mm 1mm 2mm Ceramic Plate Silicon Nitride Si3n4 Substrate
 
Polished 0.5mm 1mm 2mm Ceramic Plate Silicon Nitride Si3n4 Substrate
Polished 0.5mm 1mm 2mm Ceramic Plate Silicon Nitride Si3n4 Substrate

Certifications

Polished 0.5mm 1mm 2mm Ceramic Plate Silicon Nitride Si3n4 Substrate

Our Partners

Polished 0.5mm 1mm 2mm Ceramic Plate Silicon Nitride Si3n4 Substrate

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