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| Application: | Electronic Devices, Lighting, Power Supply, Semiconductors |
| Material: | AlN |
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The aluminum nitride substrate offers a super high thermal conductivity of more than 170W/mK, high resistivity, low dielectric loss, good insulation, and some other excellent properties. It is the best choice for a wide range of industrial insulating heat sink material of high power machinery and equipment such as high-frequency equipment substrate, high power transistor module substrate, high-density hybrid circuits, microwave power devices, power semiconductor devices, power electronic devices, optoelectronic components, laser-semi-conductor, LED, IC products, and so on.
AlN substrate can be the best solution in electronics applications where strict conditions are required, such as power modules (MOSFET, IGBT), LED packages for cooling and protecting circuits, packages, and modules.
The specification of aluminum nitride substrate
| Typical thickness | 0.385mm, 0.50mm, 0.635mm, 1.0mm, 1.2mm and 1.5mm |
| Dimensional capability | Max. side-length to be 500mm by 400mm; Max OD to be 400mm |
| Tolerance | OD can be ± 0.01mm; Thickness can be ± 0.005mm |
| Surface treatment | Natural surface, lapping, diamond-like polishing, metallization, glazed |

1. 15+ Years of manufacturing experience in OEM, ODM, and trusted & professional teams
2. Powerful R&D, prototyping & mass production capability to support trial order and high volume production
3. In-house comprehensive manufacturing types of equipment from raw materials to high precision machining
4. Rigorous quality control system and processes, including IQC, IPQC, QA, OQC in working instructions
5. Surpassing pre-sales, sales, and after-sales service abide all orders every customer as the first priority

