| Application: | Structure Ceramic, Industrial Ceramic |
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| Type: | Ceramic Plate |
| Finished Product: | Ceramic Circuit Board |
| Substrate Material: | Aluminium Nitride ( Aln ) Ceramic |
| Usage: | to Realize Electrical Connections |
| Feature: | Strong Bonding Strength Between Ceramic and Metal |
| Customization: |
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Audited Supplier Jinghui Ceramic has advanced surface treatment process of ceramic substrates and has mass production capacity. Our products have been verified by the market for 15 years. The quality is reliable and stable. Welcome to consult us.
Why Metallization is Necessary on the Surface of Ceramic Substrates
We need to realize electrical connections through the ceramic substrate. Therefore, the surface of the ceramic substrate needs to be metallized, and then the surface pattern is completed by the method of image transfer.
Metallization is a crucial part of the production of ceramic substrates, because the wetting ability of metals on ceramic surfaces at high temperatures determines the bonding force between metals and ceramics, which is an important guarantee for the stability of packaging performance.
Therefore, how to implement metallization on the surface of ceramic substrates and improve the bonding force between the two has become the focus of research by many scientists.
Which Metallization Processes We Support?
Jinghui Ceramic can process precision circuits, especially good at Mo-Mn metallization, electroless nickel plating method, silver metallization, and DBC technology. You can consult us for more metallization methods.
1. Mo-Mn Metallization
2. Electroless Nickel Plating Method
3. Silver Metallization
4. Direct Bonded Copper ( DBC ) Technology
Where are Ceramic Circuit Boards Mainly Used?
In order to ensure product quality, we implement strict inspection in every production link. You are welcome to contact us for a quote.
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Audited Supplier 
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