96% 99.6% Thick Thin Film Circuit Metallized Al2O3 Alumina Ceramic Substrate

Product Details
Customization: Available
Application: Refractory, Structure Ceramic, Industrial Ceramic, Brazing
Material: Al2O3, Alumina Ceramic
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Registered Capital
1000000 RMB
Plant Area
20000 square meters
  • 96% 99.6% Thick Thin Film Circuit Metallized Al2O3 Alumina Ceramic Substrate
  • 96% 99.6% Thick Thin Film Circuit Metallized Al2O3 Alumina Ceramic Substrate
  • 96% 99.6% Thick Thin Film Circuit Metallized Al2O3 Alumina Ceramic Substrate
  • 96% 99.6% Thick Thin Film Circuit Metallized Al2O3 Alumina Ceramic Substrate
  • 96% 99.6% Thick Thin Film Circuit Metallized Al2O3 Alumina Ceramic Substrate
  • 96% 99.6% Thick Thin Film Circuit Metallized Al2O3 Alumina Ceramic Substrate
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Basic Info.

Model NO.
Customized
Product Name
Dbc Ceramic Substrate
Optional Purity
96%, 99% Alumina
Color
White, Beige
Surface Treatment
Polished, Glazed
Norminal
1% of Dimensions
Usage
for Ceramic to Metal Joint Technology
Type
Ceramic Parts
Transport Package
Vacuum Packaging with Desciant
Specification
36cm x 20cm x 24cm
Trademark
JingHui
Origin
China
HS Code
8547100000
Production Capacity
50000/Month

Product Description

96% 99.6% Thick Thin Film Circuit Metallized Al2O3 Alumina Ceramic Substrate


Alumina ceramic is currently the most widely used ceramic packaging substrate material. It has excellent properties such as high strength, high temperature resistance, thermal shock resistance, electrical insulation and corrosion resistance.


Different Types of Alumina Ceramic Substrates

Thick film circuit substrates generally use 96% alumina, and thin film circuit substrates generally use 99.6% alumina.

1. 96% Alumina Ceramic Substrate

Suitable for low-power electronic components, sensors, capacitors, micro-relays, microwave components and other fields.

96% 99.6% Thick Thin Film Circuit Metallized Al2O3 Alumina Ceramic Substrate

2. 99.6% Alumina Ceramic Substrate

Suitable for high-power LEDs, high-voltage integrated circuits, high-temperature sensors, high-frequency electronic components and other fields.


96% 99.6% Thick Thin Film Circuit Metallized Al2O3 Alumina Ceramic Substrate

Ceramic metallization methods

Our company supports the following metallization methods for ceramics:

1. TFC Thin Film Ceramic Substrate

(1) Uniform metallization layer and high graphic precision.
(2) Mainly used in the packaging of small current devices in the communication field.

2. TPC Thick Printing Ceramic Substrate

(1) Good heat resistance and reliable performance.
(2) Mature technology, high production efficiency and low manufacturing cost.
(3) Mostly used in occasions with high voltage, high current and high power.

3. DPC Direct Plated Copper Ceramic Substrate

(1) High graphic precision and vertical interconnection.
(2) Precise alignment, and no difference in sintering shrinkage.

4. DBC Direct Bonded Copper Ceramic Substrate

(1) Strong current-carrying capacity.
(2) Good heat resistance and reliable performance.
(3) Precise alignment, and no difference in sintering shrinkage.


96% 99.6% Thick Thin Film Circuit Metallized Al2O3 Alumina Ceramic Substrate


Why Choose Us

Jinghui Ceramic has more than 15 years of experience in manufacturing metallized ceramic substrates. In addition to price advantages, we can also provide customers with small batch trial production and proofing services.

We have complete manufacturing equipment, including molding, sintering, CNC machining, precision grinding, laser cutting, etc. In addition, we have an experienced technical team to help us control quality well and also facilitate cost control.

96% 99.6% Thick Thin Film Circuit Metallized Al2O3 Alumina Ceramic Substrate
96% 99.6% Thick Thin Film Circuit Metallized Al2O3 Alumina Ceramic Substrate
96% 99.6% Thick Thin Film Circuit Metallized Al2O3 Alumina Ceramic Substrate
96% 99.6% Thick Thin Film Circuit Metallized Al2O3 Alumina Ceramic Substrate

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