| Customization: | Available |
|---|---|
| Application: | Refractory, Structure Ceramic, Industrial Ceramic, Brazing |
| Material: | Alumina Ceramic |
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Thin-film ceramic substrates generally use a sputtering process to directly deposit a metal layer on the surface of the ceramic substrate. If lithography, development, etching and other processes are assisted, the metal layer can also be patterned into circuits.
Due to the low sputtering coating deposition rate (generally less than 1 μm/h), the thickness of the metal layer on the surface of the TFC substrate is small (generally less than 1 μm), and ceramic substrates with high pattern accuracy (line width/line spacing less than 10 μm) can be prepared , mainly used in the packaging of small current devices in the field of laser and optical communication.
Jinghui is a manufacturer of proofing and production of ceramic circuit boards. We have more than ten years of experience in circuit board
production. We can process precision circuits, especially good at DBC technology, silver firing technology, electroless nickel plating technology and
Mo-Mn technology. You can consult Jinghui for more processing methods of ceramic substrates.
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