| Customization: | Available |
|---|---|
| Material: | Alumina Ceramic |
| Finished Product: | Ceramic Circuit Board |
Suppliers with verified business licenses
Audited Supplier Audited by an independent third-party inspection agency
A brief description of the production process
- Add oxygen between copper and ceramic substrate to obtain a Cu-O eutectic liquid with a temperature of 1065-1083°C.
- The intermediate phase (CuAlO2 or CuAl2O4) is obtained through the reaction to achieve chemical metallurgical bonding between the Cu layer and the ceramic substrate.
- Use photolithography technology to realize patterns and form circuits.
Advantages of Direct Bonded Copper (DBC) Ceramic Substrate
DBC ceramic substrate is a proven standard device in power electronic modules and has obvious advantages in IGBT and LD packaging fields. The copper foil of DBC ceramic substrate is generally thicker and has a strong current-carrying capacity, which can meet the application requirements of device packaging in extreme environments such as high temperature and high current. The process temperature of DBC ceramic substrate is high.
){kind=link}