Dcb / Dbc Ceramic Substrate Direct Copper Bonding PCB Board

• Material: Alumina Ceramic
• Type: Ceramic Plates
• Finished Product: Ceramic Circuit Board
• Surface Metallization Process: Direct Bonded Copper (Dbc) Technology
• Feature: Strong Bonding Strength Between Ceramic and Metal
• Usage: to Realize Electrical Connections
• Model NO.: Customized
• Transport Package: Vacuum Packaging
• Specification: According to the Drawing
• Trademark: JingHui
• Origin: China
• HS Code: 8547100000

Product Description

DCB / DBC Ceramic Substrate Direct Copper Bonding PCB Board

DBC ceramic substrates are widely used in the packaging and heat dissipation of Insulated Gate Bipolar Transistor (IGBT), Laser Diode (LD) and Concentrator Photovoltaics (CPV). Jinghui Ceramic strictly controls the eutectic temperature and oxygen content in the production of DBC ceramic substrates. Our technology is mature and you can trust it.
 

A brief description of the production process

- Add oxygen between copper and ceramic substrate to obtain a Cu-O eutectic liquid with a temperature of 1065-1083°C.

- The intermediate phase (CuAlO2 or CuAl2O4) is obtained through the reaction to achieve chemical metallurgical bonding between the Cu layer and the ceramic substrate.

- Use photolithography technology to realize patterns and form circuits.


Advantages of Direct Bonded Copper (DBC) Ceramic Substrate

DBC ceramic substrate is a proven standard device in power electronic modules and has obvious advantages in IGBT and LD packaging fields. The copper foil of DBC ceramic substrate is generally thicker and has a strong current-carrying capacity, which can meet the application requirements of device packaging in extreme environments such as high temperature and high current. The process temperature of DBC ceramic substrate is high.