Thick Film PCB Board Tpc Process Metallized Alumina Ceramic Substrate

• Application: Structure Ceramic, Industrial Ceramic
• Type: Ceramic Plates
• Material: Ceramics, Alumina Ceramic
• Production Process: Thick Film
• Finished Product: Ceramic Circuit Board
• Feature: Reliable Performance
• Model NO.: Customized
• Usage: to Realize Electrical Connections
• Transport Package: Vacuum Packaging
• Specification: According to the Drawing
• Trademark: JingHui
• Origin: China
• HS Code: 8547100000

Product Description

Thick Film PCB Board TPC Process Metallized Alumina Ceramic Substrate

Product Introduction

Introduction of Thick Printing Ceramic (TPC) Substrate

Thick Printing Ceramic (TPC) Substrate refers to the production process of directly coating the conductive paste on the ceramic substrate by screen

printing, and then sintering at high temperature to make the metal layer firmly adhere to the ceramic substrate. 

Depending on the viscosity of the metal paste and the mesh size of the screen, the thickness of the metal circuit layer is generally several microns to

tens of microns (increasing the thickness of the metal layer can be achieved by multiple screen printing).



Advantage of the TPC Process

1. Good heat resistance and reliable performance.

2. Mature technology, high production efficiency and low manufacturing cost.

3. Mostly used in occasions with high voltage, high current and high power.

Product Parameters

The following is a comparison table of TPC process and other processes.

What are the Technical Difficulties of the TPC Process?

The selection of conductor paste is a key factor to influence the TPC process, which is composed of functional phase (ie metal powder, particle

size within 2μm), binding phase (binder) and organic carrier.


1. The binding phase is generally glass frit or metal oxide or a mixture of the two. Its function is to connect ceramics and metals and determine the

adhesion of conductor paste to the ceramic substrate, so it is the key to the production of conductor paste.


2. The role of the organic carrier is mainly to disperse the functional phase and the binding phase, while maintaining a certain viscosity of the

conductor paste, preparing for the subsequent screen printing, and will gradually volatilize during the sintering process.


3. The functional phase is generally metal powder of Au, Pt, Au/Pt, Au/Pd, Ag, Ag/Pt, Ag/Pd, Cu, Ni, Al and W, among which Ag, Ag/Pd and Cu are

mostly common. Metal powder is the core substance in the thick film paste, and after heat treatment, a metal layer is formed on the surface of the

ceramic substrate, thereby realizing the surface metallization of the ceramic substrate.

Our Advantages

Jinghui has rich experience in manufacturing metallized ceramic substrates, and can carry out proofing or mass production according to product

design drawings and requirements given by users. You are welcome to consult us for business.