Dielectric: | AIN |
---|---|
Finished Product: | Ceramic Circuit Board |
Substrate Material: | Aluminum Nitride (Aln) Ceramic |
Surface Metallization Process: | Mo-Mn Metallization and Ni Plating |
Feature: | Strong Bonding Strength Between Ceramic and Metal |
Usage: | to Realize Electrical Connections |
Customization: |
---|