| Dielectric: | AIN |
|---|---|
| Finished Product: | Ceramic Circuit Board |
| Substrate Material: | Aluminum Nitride (Aln) Ceramic |
| Surface Metallization Process: | Mo-Mn Metallization and Ni Plating |
| Feature: | Strong Bonding Strength Between Ceramic and Metal |
| Usage: | to Realize Electrical Connections |
| Customization: |
|---|
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Audited Supplier Is it good to use ceramic substrate?
The answer is yes. With the continuous development of power device technology, especially with the rise of the third-generation semiconductor
technology, the application fields and demand of ceramic substrates continue to expand due to their good thermal conductivity, heat resistance, high
strength and high reliability. You can see the advantages of ceramic substrates through the comparison table between ceramic substrates and
ordinary PCB boards below.
There are many metallization methods on the surface of ceramic substrates. Here we focus on the Mo-Mn method.
Process of Molybdenum-Manganese / Nickel Plating:
1. A coating of Mo and Mn particles mixed with silicates and glass additives and volatile carriers is applied onto the ceramic surface to be brazed.
2. The coating is fired in a wet hydrogen environment at 1480-1520ºC, leaving a "glassy" metallic coating.
3. The coating is subsequently plated with a layer of Ni.
Where are Ceramic Circuit Boards Mainly Used?
Ceramic substrates have very broad application prospects in high-power LED industry, high-frequency electronic equipment, large-scale network
base stations, filter devices and other fields.
In order to ensure the best performance of our ceramic circuit boards, All products have to pass strict inspection before they go out.
Jinghui has advanced metallized ceramic substrate production equipment and technology, and can meet customers' R&D process and production
needs with fast delivery and stable quality, giving priority to quality and helping customers seize market opportunities.
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