Molybdenum-Manganese / Nickel Plating Process Aluminum Nitride Aln Ceramic PCB

Product Details
Customization: Available
Application: Electronic Devices, Lighting, Power Supply, Semiconductors
Thickness: Customized
Manufacturer/Factory, Trading Company, Group Corporation

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Registered Capital
1000000 RMB
Plant Area
20000 square meters
  • Molybdenum-Manganese / Nickel Plating Process Aluminum Nitride Aln Ceramic PCB
  • Molybdenum-Manganese / Nickel Plating Process Aluminum Nitride Aln Ceramic PCB
  • Molybdenum-Manganese / Nickel Plating Process Aluminum Nitride Aln Ceramic PCB
  • Molybdenum-Manganese / Nickel Plating Process Aluminum Nitride Aln Ceramic PCB
  • Molybdenum-Manganese / Nickel Plating Process Aluminum Nitride Aln Ceramic PCB
  • Molybdenum-Manganese / Nickel Plating Process Aluminum Nitride Aln Ceramic PCB
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  • Overview
  • Product Introduction
  • Production Process
  • Product Applications
  • Product Inspection
  • Why Choose Us?
Overview

Basic Info.

Model NO.
Customized
Dielectric
Ain
Finished Product
Ceramic Circuit Board
Substrate Material
Aluminum Nitride (Aln) Ceramic
Surface Metallization Process
Mo-Mn Metallization and Ni Plating
Feature
Strong Bonding Strength Between Ceramic and Metal
Usage
to Realize Electrical Connections
Transport Package
Vacuum Packaging
Specification
According to the Drawing
Trademark
JingHui
Origin
China
HS Code
8547100000

Product Description

Molybdenum-Manganese / Nickel Plating Process Aluminum Nitride AlN Ceramic PCB
Product Introduction

Is it good to use ceramic substrate?

The answer is yes. With the continuous development of power device technology, especially with the rise of the third-generation semiconductor

technology, the application fields and demand of ceramic substrates continue to expand due to their good thermal conductivity, heat resistance, high

strength and high reliability. You can see the advantages of ceramic substrates through the comparison table between ceramic substrates and

ordinary PCB boards below.

Molybdenum-Manganese / Nickel Plating Process Aluminum Nitride Aln Ceramic PCB

Production Process

There are many metallization methods on the surface of ceramic substrates. Here we focus on the Mo-Mn method.

Process of Molybdenum-Manganese / Nickel Plating:

1. A coating of Mo and Mn particles mixed with silicates and glass additives and volatile carriers is applied onto the ceramic surface to be brazed.

2. The coating is fired in a wet hydrogen environment at 1480-1520ºC, leaving a "glassy" metallic coating.

3. The coating is subsequently plated with a layer of Ni.

Molybdenum-Manganese / Nickel Plating Process Aluminum Nitride Aln Ceramic PCB
Product Applications

Where are Ceramic Circuit Boards Mainly Used?

Ceramic substrates have very broad application prospects in high-power LED industry, high-frequency electronic equipment, large-scale network

base stations, filter devices and other fields.

Molybdenum-Manganese / Nickel Plating Process Aluminum Nitride Aln Ceramic PCB

Product Inspection

In order to ensure the best performance of our ceramic circuit boards, All products have to pass strict inspection before they go out.

Molybdenum-Manganese / Nickel Plating Process Aluminum Nitride Aln Ceramic PCB

Why Choose Us?

Jinghui has advanced metallized ceramic substrate production equipment and technology, and can meet customers' R&D process and production

needs with fast delivery and stable quality, giving priority to quality and helping customers seize market opportunities.
Molybdenum-Manganese / Nickel Plating Process Aluminum Nitride Aln Ceramic PCB

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