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Mr. Andy Chen
Technical Sales Manager

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Ceramic Substrates with Surface Metallization Using Electroless Nickel Plating Process pictures & photos
Ceramic Substrates with Surface Metallization Using Electroless Nickel Plating Process pictures & photos
Ceramic Substrates with Surface Metallization Using Electroless Nickel Plating Process pictures & photos
Ceramic Substrates with Surface Metallization Using Electroless Nickel Plating Process pictures & photos
Ceramic Substrates with Surface Metallization Using Electroless Nickel Plating Process pictures & photos
Ceramic Substrates with Surface Metallization Using Electroless Nickel Plating Process pictures & photos
  • Ceramic Substrates with Surface Metallization Using Electroless Nickel Plating Process
  • Ceramic Substrates with Surface Metallization Using Electroless Nickel Plating Process
  • Ceramic Substrates with Surface Metallization Using Electroless Nickel Plating Process
  • Ceramic Substrates with Surface Metallization Using Electroless Nickel Plating Process
  • Ceramic Substrates with Surface Metallization Using Electroless Nickel Plating Process
  • Ceramic Substrates with Surface Metallization Using Electroless Nickel Plating Process
Application: Structure Ceramic, Industrial Ceramic
Material: Alumina Ceramic
Type: Ceramic Plates
Finished Product: Ceramic Circuit Board
Substrate Material: 96%, 99.6% Alumina
Surface Metallization Process: Electroless Nickel Plating Process
Customization:

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