Ceramic Substrates with Surface Metallization Using Electroless Nickel Plating Process

Product Details
Customization: Available
Application: Electronic Devices, Lighting, Power Supply, Semiconductors, Structure Ceramic, Industrial Ceramic
Material: Alumina Ceramic
Manufacturer/Factory, Trading Company, Group Corporation

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1000000 RMB
Plant Area
20000 square meters
  • Ceramic Substrates with Surface Metallization Using Electroless Nickel Plating Process
  • Ceramic Substrates with Surface Metallization Using Electroless Nickel Plating Process
  • Ceramic Substrates with Surface Metallization Using Electroless Nickel Plating Process
  • Ceramic Substrates with Surface Metallization Using Electroless Nickel Plating Process
  • Ceramic Substrates with Surface Metallization Using Electroless Nickel Plating Process
  • Ceramic Substrates with Surface Metallization Using Electroless Nickel Plating Process
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  • Overview
  • Product Introduction
  • Our Advantages
Overview

Basic Info.

Model NO.
Customized
Finished Product
Ceramic Circuit Board
Substrate Material
96%, 99.6% Alumina
Surface Metallization Process
Electroless Nickel Plating Process
Feature
Excellent Electrical and Thermal Properties
Usage
to Realize Electrical Connections
Type
Ceramic Plates
Transport Package
Vacuum Packaging
Specification
According to the Drawing
Trademark
JingHui
Origin
China
HS Code
8547100000

Product Description

Ceramic Substrates with Surface Metallization Using Electroless Nickel Plating Process
Product Introduction

Where are Ceramic Circuit Boards Mainly Used?


With the continuous development of power device technology, especially with the rise of the third-generation semiconductor technology, the

application fields and demand of ceramic substrates continue to expand due to their good thermal conductivity, heat resistance, high strength and

high reliability.



Ceramic substrates have very broad application prospects in high-power LED industry, high-frequency electronic equipment, large-scale network

base stations, filter devices and other fields.


Ceramic Substrates with Surface Metallization Using Electroless Nickel Plating Process

What is Electroless Nickel Plating Method?


Electroless nickel plating technology is a deposition process in which

metals are produced through controllable redox reactions under the

catalysis of metals. Compared with electroplating nickel, electroless

nickel plating has the characteristics of uniform coating, small

pinholes, no need for DC power supply equipment, deposition on non-

conductors and some special properties.


In addition, due to less waste discharge, less environmental pollution

and lower cost, electroless nickel plating technology has gradually

replaced electroplating nickel in many fields and has become an

environmentally friendly surface treatment process.


The brief process of electroless nickel plating technology is shown in

the picture on the right.
Ceramic Substrates with Surface Metallization Using Electroless Nickel Plating Process

 

Our Advantages

Jinghui has rich experience in manufacturing metallized ceramic substrates, and can carry out proofing or mass production according to product

design drawings and requirements given by users. You are welcome to consult us for business.

Ceramic Substrates with Surface Metallization Using Electroless Nickel Plating Process

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