Application: | Laser Diode (Ld) |
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Finished Product: | Ceramic Circuit Board |
Substrate Material: | Aluminium Nitride (Aln) Ceramic |
Surface Metallization Process: | Direct Bond Copper (Dbc / Dcb) |
Feature: | Strong Bonding Strength Between Ceramic and Metal |
Transport Package: | Vacuum Packaging |
Customization: |
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