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| Customization: | Available |
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| Application: | Electronic Devices, Lighting, Power Supply, Semiconductors |
| Material: | Al2O3 |
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1. Material: 96% or 99.6% alumina ceramic
2. Dimensional capability: side length max. 400mm x 600mm; Thickness range from 0.15mm to 30mm.
3. Surface treatment: natural surface, lapping, diamond-like polishing, metallizing
4. Hole size and tolerance after laser cutting:
| Hole Diameter (mm) | Standard Tolerance (mm) |
| φ≤0.5 | 0.08 |
| φ>0.5 | 0.20 |
| Substrate Thickness (mm) | The Percentage of Laser Scribe Line Depth to Thickness (%) |
| 0.2-0.3 | 40%±5% |
| 0.3<T≤0.5 | 50%±3% |
| 0.5<T≤1.0 | 43%±3% |
| 1.2 | 55%±3% |
| 1.5 | 55%±3% |
| 2.0 | 55%+10% |
| The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-1.0mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm. | |
Laser scribing has been becoming the most popular machining process for electronic ceramic substrates. It offers much high efficiency and precision dimensional tolerance. The process involves pulsing a CO2 laser through an optical configuration, through a focusing lens, focusing the beam through an air assisted nozzle assembly, and finally onto the substrate's work surface. Most Laser scribing systems utilize a CNC or PC based motion control system, moving the substrate below the fixed beam assembly at speeds as fast as 10 in./sec, or faster.
Each pulse of the Laser provides an efficient and effective evacuation of molten and ablated ceramic substrate particulates. Well executed scribes allow for subsequent controlled breaks, or "Snapping", of the substrate to its final size.
Q01: What sizes are available for the alumina substrates?
A: The typical largest size available is 280x240mm. Maximum standard thickness is 1.27mm and up to 2.0mm thicknesses are available per request. We offer customized products for special requirements.
Q02: What are the main advantages of a Ceramic PCB?
A: Maximum operating temperature is over 800°C; high Thermal Conductivity of up to 180W/mK;, very low CTE (Coefficient of Thermal Expansion); 0% water absorption for hermetic packages; low signal loss and fine microcircuit applications.
Q03: What is the via diameter available for alumina substrates?
A: Round vias with diameters of 0.2mm are available. Square holes and special shape holes are also available per request. Please contact us for details.
Q04: How are the ceramic substrates machined?
A: We use 100% laser processing. It is the best way to ensure precise and clean milling and drilling of ceramics.
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