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Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate

SHENZHEN JINGHUI INDUSTRY LIMITED
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  • 7 yrs

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Product Highlights

  • Wide Thickness Range: Available thickness from 0.15mm to 30mm to suit various application needs.
  • High Purity Options: Offering 96% and 99.6% Alumina purity levels for diverse performance requirements.
  • Customizable Colors: Optional colors include White, Ivory, and Pink for specific aesthetic needs.
  • Versatile Surface Treatments: Options include natural surface, lapping, diamond-like polishing, and metallizing.
  • OEM and ODM Services: Full customization support including prototyping and mass production capabilities.

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Product Images of Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate

Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate
Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate pictures & photos
Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate
Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate pictures & photos
Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate
Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate pictures & photos
Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate
Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate pictures & photos
Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate
Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate pictures & photos
Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate
Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate pictures & photos
Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate
  • Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate
  • Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate
    Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate
  • Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate
    Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate
  • Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate
    Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate
  • Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate
    Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate
  • Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate
    Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate
  • Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate
    Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate

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Product Description

Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate

The specification

1. Material: 96% or 99.6% alumina ceramic

2. Dimensional capability: side length max. 400mm x 600mm; Thickness range from 0.15mm to 30mm.

3. Surface treatment: natural surface, lapping, diamond-like polishing, metallizing

4. Hole size and tolerance after laser cutting:

Hole Diameter (mm) Standard Tolerance (mm)
φ≤0.5 0.08
φ>0.5 0.20

5. The scribing line specification:
 
Substrate Thickness (mm) The Percentage of Laser Scribe Line Depth to Thickness (%)
0.2-0.3 40%±5%
0.3<T≤0.5 50%±3%
0.5<T≤1.0 43%±3%
1.2 55%±3%
1.5 55%±3%
2.0 55%+10%
The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-1.0mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.

Product Description

Laser scribing has been becoming the most popular machining process for electronic ceramic substrates. It offers much high efficiency and precision dimensional tolerance. The process involves pulsing a CO2 laser through an optical configuration, through a focusing lens, focusing the beam through an air assisted nozzle assembly, and finally onto the substrate's work surface. Most Laser scribing systems utilize a CNC or PC based motion control system, moving the substrate below the fixed beam assembly at speeds as fast as 10 in./sec, or faster.


Each pulse of the Laser provides an efficient and effective evacuation of molten and ablated ceramic substrate particulates. Well executed scribes allow for subsequent controlled breaks, or "Snapping", of the substrate to its final size.

Typical Applications

Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate

We also produce

Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate
Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate
Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate

 

Certifications

Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate

FAQ

Q01: What sizes are available for the alumina substrates?
A: The typical largest size available is 280x240mm. Maximum standard thickness is 1.27mm and up to 2.0mm thicknesses are available per request. We offer customized products for special requirements.

 

Q02: What are the main advantages of a Ceramic PCB?
A: Maximum operating temperature is over 800°C; high Thermal Conductivity of up to 180W/mK;, very low CTE (Coefficient of Thermal Expansion); 0% water absorption for hermetic packages; low signal loss and fine microcircuit applications.

Q03: What is the via diameter available for alumina substrates?
A: Round vias with diameters of 0.2mm are available. Square holes and special shape holes are also available per request. Please contact us for details.

Q04: How are the ceramic substrates machined?
A: We use 100% laser processing. It is the best way to ensure precise and clean milling and drilling of ceramics.

About the Supplier

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SHENZHEN JINGHUI INDUSTRY LIMITED
SHENZHEN JINGHUI INDUSTRY LIMITED
SHENZHEN JINGHUI INDUSTRY LIMITED
SHENZHEN JINGHUI INDUSTRY LIMITED
SHENZHEN JINGHUI INDUSTRY LIMITED
SHENZHEN JINGHUI INDUSTRY LIMITED
SHENZHEN JINGHUI INDUSTRY LIMITED
SHENZHEN JINGHUI INDUSTRY LIMITED

About Our Factory & Business Background

Address
1st Bldg, No. 6352, Pingshan Ave., Shatian Community, Kengzi, Pingshan, Shenzhen, Guangdong, China
Terms of Payment
LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram, RMB
International Commercial Terms(Incoterms)
FOB, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA, EXW
Average Lead Time
Peak Season Lead Time: 1-3 months
Off Season Lead Time: within 15 workdays
Nearest Port
Shenzhen, HongKong, Shanghai

Our Production Capability & Technical Expertise

Main Products
Metallized Ceramics, Ceramic Substrates, Pepper Mill Mechanism, Pepper Grinder Mechanism, Ceramic Parts, Precision Ceramics, Zirconia Ceramics, Ceramic Insulators, Silicon Nitride Ceramics, Aluminum Nitride Ceamics

Our Industry Experience & Global Business Record

Export Year
2009-03-11
Main Markets
North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe

FAQ

What sizes are available for the alumina substrates?
The typical largest size available is 280x240mm. Maximum standard thickness is 1.27mm and up to 2.0mm thicknesses are available per request. We offer customized products for special requirements.
What is the via diameter available for alumina substrates?
Round vias with diameters of 0.2mm are available. Square holes and special shape holes are also available per request. Please contact us for details.
How are the ceramic substrates machined?
We use 100% laser processing. It is the best way to ensure precise and clean milling and drilling of ceramics.

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