Standard High Heat Dissipation 95 Alumina Ceramic LED Substrate

Product Details
Customization: Available
Application: Electronic Devices, Lighting, Power Supply, Semiconductors, Electronics, Refractory
Material: Alumina Ceramic
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  • Standard High Heat Dissipation 95 Alumina Ceramic LED Substrate
  • Standard High Heat Dissipation 95 Alumina Ceramic LED Substrate
  • Standard High Heat Dissipation 95 Alumina Ceramic LED Substrate
  • Standard High Heat Dissipation 95 Alumina Ceramic LED Substrate
  • Standard High Heat Dissipation 95 Alumina Ceramic LED Substrate
  • Standard High Heat Dissipation 95 Alumina Ceramic LED Substrate
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  • Overview
  • Product Introduction
  • Manufacturing Capacity
  • Production Process
  • Product Inspection
  • Product Recommendations
Overview

Basic Info.

Model NO.
Standard
Forming Method
Tape Casting
Features
High Mechanical Strength, Small Dielectric Loss
Optional Color
White, Ivory, Pink, Black
Density
Over 3.70g/cm3
Standard Thickness
0.25-2.0mm Available
Thickness Tolerance
0.03/0.05mm (Depending on Thickness)
Length and Width Tolerance
±2mm
Grain Size
1-10um
Purity
95%
Type
Ceramic Plate
Transport Package
Individual Package
Specification
Max. up to 500mm x 500mm
Trademark
JingHui
Origin
China
HS Code
8547100000

Product Description

Standard High Heat Dissipation 95 Alumina Ceramic Led Substrate

Product Introduction

The ceramic substrate is a commonly used electronic packaging substrate material. Compared with plastic and metal substrates, ceramic substrate has the following advantages:

1) Good Insulation
Generally speaking, the higher the substrate resistance, the better the reliability of the package. Ceramic materials are generally covalent bond compounds with better insulation properties.

2) Low Dielectric Coefficient and Good Frequency Performance
The low dielectric constant and dielectric loss of ceramic materials can reduce the signal delay time and increase the transmission speed.

3) Small Coefficient of Thermal Expansion (CTE)
Covalent bond compounds generally have high melting points, and the higher the melting point, the smaller the thermal expansion coefficient, so the CTE of ceramic materials is generally small.

4) High Thermal Conductivity
Ceramic substrate materials are widely used in high-reliability, high-frequency, high-temperature resistance, and strong air-tight product packaging in aviation, aerospace, and military engineering. The packaging of ceramic substrate materials is generally a multilayer ceramic substrate package, which is widely used in hybrid integrated circuits (HIC) and multi-chip module (MCM) ceramic packages.

For material properties, please refer to the table below.

Alumina Ceramic Substrate
Item Unit 96% Al2O3 99.6% Al2O3
Mechanical Properties
Color / / White White
Density Drainage Method g/cm3 3.70 3.95
Light Reflectivity 400nm/1mm % 94 83
Flexural Strength Three Point Bending MPa >350 >500
Fracture Toughness Indentation Method MPa·m1/2 3.0 3.0
Vickers Hardness Load 4.9N GPa 14 16
Young's Modulus Stretching Method GPa 340 300
Water Absorption    % 0 0
Camber / Length‰ T≤0.3: 5, Others: ≤3‰ ≤3‰
Thermal Properties
Max. Service Temperature (Non-loading) / ºC 1200 1400
CTE (Coefficient of
Thermal Expansion)
20-800ºC 1×10-6/ºC 7.8 7.9
Thermal Conductivity 25ºC W/m·K >24 >29
Thermal Shock Resistance 800ºC 10 Times No Crack No Crack
Specific Heat 25ºC J/kg·k 750 780
Electrical Properties
Dielectric Constant 25ºC, 1MHz / 9.4 9.8
Dielectric Loss Angle 25ºC, 1MHz ×10-4 ≤3 ≤2
Volume Resistivity 25ºC Ω·cm 1014 1014
Dielectric Strength DC KV/mm 15 15

Manufacturing Capacity

1. Product Specification

Products of various specifications can be produced. The table below shows our standard thicknesses and sizes.

Alumina Ceramic Substrate
99.6% Al2O3
Thickness (mm) Maximum Size (mm) Shape Molding Technique
As Fired Lapped Polished Rectangular Square Round
0.1-0.2   50.8 50.8   Tape Casting
0.25   114.3 114.3     Tape Casting
0.38 120 114.3 114.3     Tape Casting
0.5 120 114.3 114.3     Tape Casting
0.635 120 114.3 114.3     Tape Casting
Other special thicknesses within the thickness range of 0.1-0.635mm can be achieved by lapping.
96% Al2O3
Thickness (mm) Maximum Size (mm) Shape Molding Technique
As Fired Lapped Polished Rectangular Square Round
0.25 120 114.3 114.3     Tape Casting
0.3 120 114.3 114.3     Tape Casting
0.38 140×190         Tape Casting
0.5 140×190         Tape Casting
0.635 140×190         Tape Casting
0.76 130×140         Tape Casting
0.8 130×140         Tape Casting
0.89 130×140         Tape Casting
1 280×240         Tape Casting
1.5 165×210         Tape Casting
2 500×500         Tape Casting
Other special thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping.

2. Product Tolerances
 
Alumina Ceramic Substrate
Item Substrate Thickness (mm) Standard Tolerance (mm) Best Tolerance (mm) Laser Cutting Tolerance (mm)
Length and Width Tolerance / ±2   ±0.15
Thickness Tolerance T<0.3 ±0.03 ±0.01  
0.30-1.0 ±0.05 ±0.01  
T>1.0 ±10% ±0.01  

3. Surface Roughness
 
Alumina Ceramic Substrate
Material Surface Roughness (μm)
As Fired Lapped Polished
96% Al2O3 Ra 0.2-0.75 Ra 0.3-0.7 Ra ≤0.05
99.6% Al2O3 Ra 0.05-0.15 Ra 0.1-0.5 Ra ≤0.05

4. Laser Processing

(1) Hole Size

 
Alumina Ceramic Substrate
Hole Diameter (mm) Standard Tolerance (mm)
φ≤0.5 0.08
φ>0.5 0.2

(2) Laser Scribing
 
Alumina Ceramic Substrate
Substrate Thickness (mm) the Percentage of
Laser Scribe Line Depth
to Thickness (%)
0.2-0.3 40%±5%
0.3<T≤0.5 50%±3%
0.5<T≤1.0 43%±3%
1.2 55%±3%
1.5 55%±3%
2.0 55%+10%
The scribing spot can be in different sizes. Generally, there are small spots 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spots 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.

 

Production Process

Standard High Heat Dissipation 95 Alumina Ceramic LED Substrate

Product Inspection

Standard High Heat Dissipation 95 Alumina Ceramic LED Substrate

Product Recommendations

The company has a strong processing capacity. We offer bare ceramic substrates in various raw materials, sizes, shapes, and thicknesses. 

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Standard High Heat Dissipation 95 Alumina Ceramic LED Substrate
Standard High Heat Dissipation 95 Alumina Ceramic LED Substrate
Standard High Heat Dissipation 95 Alumina Ceramic LED Substrate

 

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