| Application: | Refractory, Structure Ceramic, Industrial Ceramic, Functional Ceramic |
|---|---|
| Material: | Alumina Ceramic |
| Type: | Ceramic Plates |
| Forming Method: | Tape Casting |
| Purity of Material: | 99.6% Alumina |
| Features: | High Mechanical Strength, Small Dielectric Loss |
| Customization: |
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Audited Supplier Introduction of the Alumina Ceramic Substrate
1. Thickness
The thicker the alumina ceramic substrate, the better the strength and the stronger the pressure resistance, but the thermal conductivity is worse than that of the thinner one. On the contrary, the thinner the substrate, the weaker the strength and pressure resistance than the thicker one, but the thermal conductivity is stronger.
2. Shape
Most of the alumina ceramic substrates are single-sided or double-sided. The shape of the substrate is generally rectangular, square or round. In PCB proofing, according to the requirements of the processing technology, some also need to make grooves or do dam on the ceramic substrate.
3. Size
The size of the alumina ceramic substrate is not the bigger the better, mainly because the base material is made of ceramics, and it is easy to cause the substrate to break during the PCB proofing process, resulting in a lot of waste.
4. Molding Technique
Common ceramic substrate molding techniques mainly include dry pressing, isostatic pressing and tape casting.
Dry Pressing has high density and good substrate flatness, but low production efficiency and high cost, making it difficult to prepare ultra-thin substrates.
Isostatic Pressing has uniform distribution of compact density and low firing shrinkage, but it is difficult to precisely control the size and shape, and the productivity is low.
Tape Casting is easy to operate, efficient in production, capable of continuous operation and has a high level of automation. The density of the embryo body and the elasticity of the diaphragm are large. The processing technology is mature. The production specifications are controllable and products of various specifications can be produced. For these reasons, tape casting is widely used in the production of alumina ceramic substrates.
Below is the process flow of our bare ceramic substrates.
1. Product Specification of 99.6% Alumina Ceramic Substrates
Products of various specifications can be produced. The table below shows our standard thicknesses and sizes.
| 99.6% Alumina Ceramic Substrate | |||||||
| Thickness (mm) | Maximum Size (mm) | Shape | Molding Technique | ||||
| As Fired | Lapped | Polished | Rectangular | Square | Round | ||
| 0.1-0.2 | 50.8 | 50.8 | √ | √ | Tape Casting | ||
| 0.25 | 114.3 | 114.3 | √ | Tape Casting | |||
| 0.38 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
| 0.5 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
| 0.635 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
| Other special thicknesses within the thickness range of 0.1-0.635mm can be achieved by lapping. | |||||||
| 99.6% Alumina Ceramic Substrate | ||||
| Item | Substrate Thickness (mm) | Standard Tolerance (mm) | Best Tolerance (mm) | Laser Cutting Tolerance (mm) |
| Length and Width Tolerance | / | ±2 | ±0.15 | |
| Thickness Tolerance | T<0.3 | ±0.03 | ±0.01 | |
| 0.30-1.0 | ±0.05 | ±0.01 | ||
| T>1.0 | ±10% | ±0.01 | ||
1. We provide personalized customization services. Machining services for products includes lapping, polishing, laser scribing, laser cutting, etc.
Surface Roughness
| 99.6% Alumina Ceramic Substrate | ||
| Surface Roughness (μm) | ||
| As Fired | Lapped | Polished |
| Ra 0.05-0.15 | Ra 0.1-0.5 | Ra ≤0.05 |
| 99.6% Alumina Ceramic Substrate | |
| Hole Diameter (mm) | Standard Tolerance (mm) |
| φ≤0.5 | 0.08 |
| φ>0.5 | 0.2 |
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