0.1mm 0.2mm Lapped Polished Substrate 99.6% Al2O3 Alumina Ceramic Wafer

Product Details
Customization: Available
Application: Refractory, Structure Ceramic, Industrial Ceramic, Functional Ceramic
Material: Al2O3, Alumina Ceramic
Manufacturer/Factory, Trading Company, Group Corporation

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1000000 RMB
Plant Area
20000 square meters
  • 0.1mm 0.2mm Lapped Polished Substrate 99.6% Al2O3 Alumina Ceramic Wafer
  • 0.1mm 0.2mm Lapped Polished Substrate 99.6% Al2O3 Alumina Ceramic Wafer
  • 0.1mm 0.2mm Lapped Polished Substrate 99.6% Al2O3 Alumina Ceramic Wafer
  • 0.1mm 0.2mm Lapped Polished Substrate 99.6% Al2O3 Alumina Ceramic Wafer
  • 0.1mm 0.2mm Lapped Polished Substrate 99.6% Al2O3 Alumina Ceramic Wafer
  • 0.1mm 0.2mm Lapped Polished Substrate 99.6% Al2O3 Alumina Ceramic Wafer
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  • Overview
  • Product Description
  • Manufacturing Capacity
  • Applications
  • Why Choose Us?
Overview

Basic Info.

Model NO.
JJBP-0112-0005
Forming Method
Tape Casting
Purity of Material
99.6% Alumina
Features
High Mechanical Strength, Small Dielectric Loss
Optional Color
White, Ivory, Pink, Black
Density
Over 3.95g/cm3
Thickness Tolerance
±0.03mm
Length and Width Tolerance
±2mm
Type
Ceramic Plates
Transport Package
Individual Package
Specification
Max. Side Length or Diameter 50.8mm
Trademark
JingHui
Origin
China
HS Code
8547100000

Product Description

0.1mm 0.2mm Lapped Polished Substrate 99.6% Al2O3 Alumina Ceramic Wafer
Product Description

Introduction of the Alumina Ceramic Substrate

1. Thickness


The thicker the alumina ceramic substrate, the better the strength and the stronger the pressure resistance, but the thermal conductivity is worse than that of the thinner one. On the contrary, the thinner the substrate, the weaker the strength and pressure resistance than the thicker one, but the thermal conductivity is stronger.

2. Shape

Most of the alumina ceramic substrates are single-sided or double-sided. The shape of the substrate is generally rectangular, square or round. In PCB proofing, according to the requirements of the processing technology, some also need to make grooves or do dam on the ceramic substrate.

3. Size

The size of the alumina ceramic substrate is not the bigger the better, mainly because the base material is made of ceramics, and it is easy to cause the substrate to break during the PCB proofing process, resulting in a lot of waste.

4. Molding Technique

Common ceramic substrate molding techniques mainly include dry pressing, isostatic pressing and tape casting.

Dry Pressing has high density and good substrate flatness, but low production efficiency and high cost, making it difficult to prepare ultra-thin substrates.

Isostatic Pressing has uniform distribution of compact density and low firing shrinkage, but it is difficult to precisely control the size and shape, and the productivity is low.

Tape Casting is easy to operate, efficient in production, capable of continuous operation and has a high level of automation. The density of the embryo body and the elasticity of the diaphragm are large. The processing technology is mature. The production specifications are controllable and products of various specifications can be produced. For these reasons, tape casting is widely used in the production of alumina ceramic substrates.

Below is the process flow of our bare ceramic substrates.

0.1mm 0.2mm Lapped Polished Substrate 99.6% Al2O3 Alumina Ceramic Wafer

Manufacturing Capacity

1. Product Specification of 99.6% Alumina Ceramic Substrates

Products of various specifications can be produced. The table below shows our standard thicknesses and sizes.

99.6% Alumina Ceramic Substrate
Thickness (mm) Maximum Size (mm) Shape Molding Technique
As Fired Lapped Polished Rectangular Square Round
0.1-0.2   50.8 50.8   Tape Casting
0.25   114.3 114.3     Tape Casting
0.38 120 114.3 114.3     Tape Casting
0.5 120 114.3 114.3     Tape Casting
0.635 120 114.3 114.3     Tape Casting
Other special thicknesses within the thickness range of 0.1-0.635mm can be achieved by lapping.

2. Product Tolerances
 
99.6% Alumina Ceramic Substrate
Item Substrate Thickness (mm) Standard Tolerance (mm) Best Tolerance (mm) Laser Cutting Tolerance (mm)
Length and Width Tolerance / ±2   ±0.15
Thickness Tolerance T<0.3 ±0.03 ±0.01  
0.30-1.0 ±0.05 ±0.01  
T>1.0 ±10% ±0.01  
Applications

0.1mm 0.2mm Lapped Polished Substrate 99.6% Al2O3 Alumina Ceramic Wafer

Why Choose Us?

1. We provide personalized customization services. Machining services for products includes lapping, polishing, laser scribing, laser cutting, etc.
 
Surface Roughness

99.6% Alumina Ceramic Substrate
Surface Roughness (μm)
As Fired Lapped Polished
Ra 0.05-0.15 Ra 0.1-0.5 Ra ≤0.05

Laser Processing: Hole Size
 
99.6% Alumina Ceramic Substrate
Hole Diameter (mm) Standard Tolerance (mm)
φ≤0.5 0.08
φ>0.5 0.2

2. In order to meet different market requirements, we put our unceasing efforts to promote quality control. Please contact us for further information.

0.1mm 0.2mm Lapped Polished Substrate 99.6% Al2O3 Alumina Ceramic Wafer

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