| Customization: | Available |
|---|---|
| Application: | Refractory, Structure Ceramic, Industrial Ceramic, Functional Ceramic |
| Material: | Al2O3, Alumina Ceramic |
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About the Size
The size of the alumina ceramic substrate is not the bigger the better, mainly because the base material is made of ceramics, and it is easy to cause the substrate to break during the PCB proofing process, resulting in a lot of waste.
Our rectangular shapes for as-fired alumina ceramic substrates are available up to 500mm×500mm.
Why Choose Ceramic Substrates?
| Alumina Ceramic Substrate | ||||
| Item | Unit | 96% Al2O3 | 99.6% Al2O3 | |
| Mechanical Properties | ||||
| Color | / | / | White | Ivory |
| Density | Drainage Method | g/cm3 | ≥3.70 | ≥3.95 |
| Light Reflectivity | 400nm/1mm | % | 94 | 83 |
| Flexural Strength | Three Point Bending | MPa | >350 | >500 |
| Fracture Toughness | Indentation Method | MPa·m1/2 | 3.0 | 3.0 |
| Vickers Hardness | Load 4.9N | GPa | 14 | 16 |
| Young's Modulus | Stretching Method | GPa | 340 | 300 |
| Water Absorption | % | 0 | 0 | |
| Camber | / | Length‰ | T≤0.3: ≤5‰, Others: ≤3‰ | ≤3‰ |
| Thermal Properties | ||||
| Max. Service Temperature (Non-loading) | / | ºC | 1200 | 1400 |
| CTE (Coefficient of Thermal Expansion) |
20-800ºC | 1×10-6/ºC | 7.8 | 7.9 |
| Thermal Conductivity | 25ºC | W/m·K | >24 | >29 |
| Thermal Shock Resistance | 800ºC | ≥10 Times | No Crack | No Crack |
| Specific Heat | 25ºC | J/kg·k | 750 | 780 |
| Electrical Properties | ||||
| Dielectric Constant | 25ºC, 1MHz | / | 9.4 | 9.8 |
| Dielectric Loss Angle | 25ºC, 1MHz | ×10-4 | ≤3 | ≤2 |
| Volume Resistivity | 25ºC | Ω·cm | ≥1014 | ≥1014 |
| Dielectric Strength | DC | KV/mm | ≥15 | ≥15 |
The molding process used for our alumina ceramic substrates is tape casting.
Because ceramics are hard and brittle materials, each of our products will be packed in a safe and reliable way to avoid damage during transportation.
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