Dbc Direct Bond Copper Al2O3 Plate Alumina Metallized Ceramic Substrate

Product Description

DBC Direct Bond Copper Al2O3 Plate Alumina Metallized Ceramic Substrate

Product Introduction

DBC alumina ceramic substrate is a high-performance electronic packaging material, widely used in high-power electronic devices, LEDs, power modules, etc. Its core is to directly bond copper foil to the surface of alumina (Al2O3) ceramics through a high-temperature process to form a composite substrate with excellent electrical, thermal and mechanical properties.

Structure and preparation process

1. Ceramic substrate: usually 96% or 99% alumina ceramic (Al2O3), with high insulation (>10 kV/mm), high temperature resistance (melting point 2050ºC) and good chemical stability.

2. Copper layer: The thickness is generally 0.1~0.6 mm. It is bonded to the ceramic eutectic in a nitrogen environment at high temperature (about 1065ºC) to form a Cu-O-Al chemical bond without the need for additional adhesive.

3. Key process steps:

- Surface treatment: The ceramic surface needs to be polished to nano-scale roughness to ensure the bonding quality.
- Eutectic reaction: At high temperature, copper reacts with oxygen elements on the ceramic surface to form a CuAlO2 transition layer.
- Patterning: Precision circuit patterns are made on the copper layer through photolithography and etching technology.

Product Features

1. High thermal conductivity: The thermal conductivity of alumina ceramics is about 24~28 W/(m·K), which is lower than aluminum nitride (AlN), but the DBC structure quickly dissipates heat through the copper layer, and the overall thermal performance is excellent.

2. Low coefficient of thermal expansion (CTE): The CTE of alumina (7~8 ppm/ºC) is close to that of silicon chips (4 ppm/ºC), reducing thermal stress.

3. High current carrying capacity: The copper layer has good conductivity and can carry large currents (such as 50 A/mm²).

4. Dielectric strength: The breakdown voltage is as high as 20 kV/mm, suitable for high-voltage applications.

5. Mechanical strength: The bending strength is 300~400 MPa, which is better than ordinary PCBs.

Product Applications

Product Inspection

Why Choose Us?

Jinghui has more than 18 years of experience in ceramic substrate production. We can process precision circuits, especially good at DBC technology, silver firing technology, electroless nickel plating technology and Mo-Mn technology. Welcome to contact us for a quote.