Al2O3 Alumina Ceramic PCB Circuit Board Dbc Direct Bond Copper Substrate

Product Details
Customization: Available
Application: Electronic Devices, Lighting, Power Supply, Semiconductors
Conductive Layer: Thick Copper Layer
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Registered Capital
1000000 RMB
Plant Area
20000 square meters
  • Al2O3 Alumina Ceramic PCB Circuit Board Dbc Direct Bond Copper Substrate
  • Al2O3 Alumina Ceramic PCB Circuit Board Dbc Direct Bond Copper Substrate
  • Al2O3 Alumina Ceramic PCB Circuit Board Dbc Direct Bond Copper Substrate
  • Al2O3 Alumina Ceramic PCB Circuit Board Dbc Direct Bond Copper Substrate
  • Al2O3 Alumina Ceramic PCB Circuit Board Dbc Direct Bond Copper Substrate
  • Al2O3 Alumina Ceramic PCB Circuit Board Dbc Direct Bond Copper Substrate
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  • Overview
  • Product Introduction
  • Product Applications
  • We Also Have
  • Why Choose Us?
Overview

Basic Info.

Model NO.
Customized
Material
Al2O3
Process
Direct Bonded Copper
Type
Ceramic Substrate
Role of The Substrate
Form an Electric Circuit and Cool The Components
Key Feature
Efficient Heat Dissipation
Transport Package
Vacuum Packaging
Specification
As Required
Trademark
JingHui
Origin
China
HS Code
8547100000
Production Capacity
50000 PCS/Month

Packaging & Delivery

Package Size
19.00cm * 10.00cm * 12.00cm
Package Gross Weight
3.000kg

Product Description

Al2O3 Alumina Ceramic PCB Circuit Board DBC Direct Bond Copper Substrate

Product Introduction

Ceramic Substrate is a frequently used electronic packaging material, widely used in the packaging of the hybrid integrated circuit and multichip module. The prime characteristics of ceramic substrates include:

1. High mechanical strength
2. Good electrical insulation
3. Low dielectric constant and dielectric loss
4. Similar thermal expansion with electronic components
5. High thermal conductivity
6. Excellent corrosion resistance

Our company has been focusing on the production of Alumina Direct Bond Copper (DBC) Substrates for more than 18 years. Alumina has excellent electrical insulation and chemical stability. It is the most mature ceramic substrate material at the moment.

Product Applications

DBC substrates are commonly used in power electronics applications, including:

High-Power Modules (IGBTs, diodes):
They provide excellent heat dissipation and insulation for high-power devices. 

Automotive Electronics:
DBC substrates are used in applications like power converters and motor controllers, where high-power and reliability are essential. 

Industrial Electronics:
They are used in applications like inverters and motor drives, where efficient heat management is critical.

We Also Have

In addition to DBC substrates, we also make Mo-Mn metallized substrates, TPC substrates and other types of ceramic substrates. You are welcome to consult.

Al2O3 Alumina Ceramic PCB Circuit Board Dbc Direct Bond Copper Substrate
Al2O3 Alumina Ceramic PCB Circuit Board Dbc Direct Bond Copper Substrate

Why Choose Us?

★ 18+ years of manufacturing experience in OEM, ODM for producing a variety of technical ceramic parts.
★ In-house comprehensive manufacturing types of equipment from raw material to secondary process.
★ Powerful R&D and mass production capability to support and meet customized needs in a short time.
★ Rigorous quality control system and processes from incoming material to shipping of finished goods.       
★ Surpassing pre-sales and after-sales service, all actions we do are just for customers' business growth.        

Al2O3 Alumina Ceramic PCB Circuit Board Dbc Direct Bond Copper Substrate

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