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| Customization: | Available |
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| Application: | Electronic Devices, Lighting, Power Supply, Semiconductors |
| Conductive Layer: | Thick Copper Layer |
| Shipping Cost: | Contact the supplier about freight and estimated delivery time. |
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Ceramic Substrate is a frequently used electronic packaging material, widely used in the packaging of the hybrid integrated circuit and multichip module. The prime characteristics of ceramic substrates include:
1. High mechanical strengthDBC substrates are commonly used in power electronics applications, including:
High-Power Modules (IGBTs, diodes):
They provide excellent heat dissipation and insulation for high-power devices.
Automotive Electronics:
DBC substrates are used in applications like power converters and motor controllers, where high-power and reliability are essential.
Industrial Electronics:
They are used in applications like inverters and motor drives, where efficient heat management is critical.
In addition to DBC substrates, we also make Mo-Mn metallized substrates, TPC substrates and other types of ceramic substrates. You are welcome to consult.

★ 18+ years of manufacturing experience in OEM, ODM for producing a variety of technical ceramic parts.
★ In-house comprehensive manufacturing types of equipment from raw material to secondary process.
★ Powerful R&D and mass production capability to support and meet customized needs in a short time.
★ Rigorous quality control system and processes from incoming material to shipping of finished goods.
★ Surpassing pre-sales and after-sales service, all actions we do are just for customers' business growth.