High Precision Fast Speed Laser Scribing Al2O3 Alumina Ceramic Substrate

• Customization: Available
• Application: Electronic Devices, Lighting, Power Supply, Semiconductors, Refractory, Structure Ceramic, Industrial Ceramic, Functional Ceramic
• Material: Al2O3
• Model NO.: JJBP-0111-0006
• Forming Method: Tape Casting
• Features: High Mechanical Strength, Small Dielectric Loss
• Optional Color: White, Ivory, Pink, Black
• Density: Over 3.70g/cm3
• Standard Thickness: 0.2-2.0mm Available
• Thickness Tolerance: ±0.03/0.05mm (Depending on Thickness)
• Length and Width Tolerance: ±2mm
• Type: Ceramic Plates
• Transport Package: Individual Package
• Specification: Max. up to 500mm x 500mm
• Trademark: JingHui
• Origin: China
• HS Code: 8547100000

Product Description

High Precision Fast Speed Laser Scribing Al2O3 Alumina Ceramic Substrat

Product Introduction

Advantages of Laser Scribing

Due to the special properties of ceramic substrate materials, they generally cannot be processed by traditional processing techniques, and laser is an ideal tool for processing such materials.

Laser scribing has high precision, fast speed, no scratch on the workpiece and no mechanical deformation, and can process any graphics.

Product Parameters

Alumina Ceramic Substrate
Item	Unit		96% Al2O3	99.6% Al2O3
Mechanical Properties
Color	/	/	White	Ivory
Density	Drainage Method	g/cm^3	≥3.70	≥3.95
Light Reflectivity	400nm/1mm	%	94	83
Flexural Strength	Three Point Bending	MPa	>350	>500
Fracture Toughness	Indentation Method	MPa·m^1/2	3.0	3.0
Vickers Hardness	Load 4.9N	GPa	14	16
Young's Modulus	Stretching Method	GPa	340	300
Water Absorption		%	0	0
Camber	/	Length‰	T≤0.3: ≤5‰, Others: ≤3‰	≤3‰
Thermal Properties
Max. Service Temperature (Non-loading)	/	ºC	1200	1400
CTE (Coefficient of Thermal Expansion)	20-800ºC	1×10^-6/ºC	7.8	7.9
Thermal Conductivity	25ºC	W/m·K	>24	>29
Thermal Shock Resistance	800ºC	≥10 Times	No Crack	No Crack
Specific Heat	25ºC	J/kg·k	750	780
Electrical Properties
Dielectric Constant	25ºC, 1MHz	/	9.4	9.8
Dielectric Loss Angle	25ºC, 1MHz	×10^-4	≤3	≤2
Volume Resistivity	25ºC	Ω·cm	≥10^14	≥10^14
Dielectric Strength	DC	KV/mm	≥15	≥15

Manufacturing Capacity

1. Laser Processing

(1) Hole Size

Alumina Ceramic Substrate
Hole Diameter (mm)	Standard Tolerance (mm)
φ≤0.5	0.08
φ>0.5	0.2

(2) Laser Scribing
 

Alumina Ceramic Substrate
Substrate Thickness (mm)	the Percentage of Laser Scribe Line Depth to Thickness (%)
0.2-0.3	40%±5%
0.3<T≤0.5	50%±3%
0.5<T≤1.0	43%±3%
1.2	55%±3%
1.5	55%±3%
2.0	55%+10%
The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.

2. Product Specification

Products of various specifications can be produced. The table below shows our standard thicknesses and sizes.

Alumina Ceramic Substrate
99.6% Al2O3
Thickness (mm)	Maximum Size (mm)			Shape			Molding Technique
	As Fired	Lapped	Polished	Rectangular	Square	Round
0.1-0.2		50.8	50.8		√	√	Tape Casting
0.25		114.3	114.3		√		Tape Casting
0.38	120	114.3	114.3		√		Tape Casting
0.5	120	114.3	114.3		√		Tape Casting
0.635	120	114.3	114.3		√		Tape Casting
Other special thicknesses within the thickness range of 0.1-0.635mm can be achieved by lapping.
96% Al2O3
Thickness (mm)	Maximum Size (mm)			Shape			Molding Technique
	As Fired	Lapped	Polished	Rectangular	Square	Round
0.25	120	114.3	114.3		√		Tape Casting
0.3	120	114.3	114.3		√		Tape Casting
0.38	140×190			√			Tape Casting
0.5	140×190			√			Tape Casting
0.635	140×190			√			Tape Casting
0.76	130×140			√			Tape Casting
0.8	130×140			√			Tape Casting
0.89	130×140			√			Tape Casting
1	280×240			√			Tape Casting
1.5	165×210			√			Tape Casting
2	500×500			√			Tape Casting
Other special thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping.

3. Product Tolerances
 

Alumina Ceramic Substrate
Item	Substrate Thickness (mm)	Standard Tolerance (mm)	Best Tolerance (mm)	Laser Cutting Tolerance (mm)
Length and Width Tolerance	/	±2		±0.15
Thickness Tolerance	T<0.3	±0.03	±0.01
	0.30-1.0	±0.05	±0.01
	T>1.0	±10%	±0.01

4. Surface Roughness

Alumina Ceramic Substrate
Material	Surface Roughness (μm)
	As Fired	Lapped	Polished
96% Al2O3	Ra 0.2-0.75	Ra 0.3-0.7	Ra ≤0.05
99.6% Al2O3	Ra 0.05-0.15	Ra 0.1-0.5	Ra ≤0.05

Applications

We also produce