High Heat Dissipation 96% Alumina Substrate in Electrical Ceramics

• Application: Refractory, Structure Ceramic, Industrial Ceramic
• Type: Ceramic Plates
• Product Name: Alumina Substrate
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: Standard
• Forming Methods: Tape Casting, ISO Pressed, Dry Pressed
• Purity of Material: 96%, 99%, 99.6%, Alumina
• Color: White, Ivory, Pink, Transparent
• Min. Thickness: 0.10mm
• Max. Thickness: 30mm
• Secondary Process: Lapping, Laser Cutting, CNC Machining
• Features: High Mechanical Strength, High Insulation
• Usage: Work as Circuit Board, Ceramic Lining Plate
• Material: Alumina Ceramic
• Transport Package: Individual Packaging with Pallet
• Specification: Max. 600mm x 500mm
• Trademark: JingHui
• Origin: China
• HS Code: 8547100000
• Production Capacity: 5000000/Month
• Package Size: 36.00cm * 20.00cm * 24.00cm
• Package Gross Weight: 8.000kg

Product Description

High Heat Dissipation 96% Alumina Substrate in Electrical Ceramics

The Prime Characteristics

 

High Purity Alumina Ceramic Substrate

1. High thermal conductivity, up to 31 W/m.k at 25ºC      
        
2. Quality surface with ideal flatness, warpage and roughness

3. High dielectric strength, low dielectric constant, and dielectric loss.

4. High hardness and exceptional flexural & fracture strength

5. Corrosion resistance and fit for various of harsh enviroments

6. Anti-oxidization and not rust for ever in very humid conditions
                      
7. Easy to achieve different pattern by laser cutting with precision tolerance.

 

The specification

 

99.6% Al2O3
Thickness (mm)	Maximum Size (mm)			Shape			Molding Technique
	As Fired	Lapped	Polished	Rectangular	Square	Round
0.1-0.2		50.8	50.8		√	√	Tape Casting
0.25		114.3	114.3		√		Tape Casting
0.38	120	114.3	114.3		√		Tape Casting
0.50	120	114.3	114.3		√		Tape Casting
0.635	120	114.3	114.3		√		Tape Casting
Other special thicknesses within the thickness range of 0.1-0.635mm can be achieved by lapping.

96% Al2O3
Thickness (mm)	Maximum Size (mm)			Shape			Molding Technique
	As Fired	Lapped	Polished	Rectangular	Square	Round
0.25	120	114.3	114.3		√		Tape Casting
0.30	120	114.3	114.3		√		Tape Casting
0.38	140×190			√			Tape Casting
0.50	140×190			√			Tape Casting
0.635	140×190			√			Tape Casting
0.76	130×140			√			Tape Casting
0.80	130×140			√			Tape Casting
0.89	130×140			√			Tape Casting
1.00	280×240			√			Tape Casting
1.50	165×210			√			Tape Casting
2.00	500×500			√			Tape Casting
Other special thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping.

 

Product Description

We focus on manufacturing alumina (Aluminum oxide, Al2O3) ceramic substrate for over 14 years under rigorous quality control with carefully selected high purity ceramic materials ranging from 95% to 99.6%.

All these ceramic substrates offer extraordinary electrical, thermal and mechnical properties, especially the outstanding thermal conductivity, similar coefficient of thermal expansion thermal to Si.  Furthermore, one of the unique properties is its superb surface roughness to be Ra0.2 which results in excellent adhesion strength with a thin film and thick film metallization due to fine particles, it's an ideal material for a wide range of circuit board.

The regular forming methods we use include tape-casting, isostatic pressing, dry pressing. We are dealing with a variety of selection of thicknesses from small-size to large-size capability. With our comprehensive types of manufacturing types of equipment, we have the capability from prototyping to mass production in the short term.

 

We also produce

 

Remark:
We not only make common square and rectangular ceramic substrate, but also round thin ceramic wafer, pink & black ceramic substrate. Moreover, we produce ceramic substrate in both aluminum nitride and silicon nitirde.
 

Typical Applications

 

Packaging & Shipping

1.  In order to ensure our customers to receive their substrate in a good conditions,  the internal configuration of packaging will be designed customized.

2. Standard packaging solution, refer to the following diagram:

 

FAQ

Q01: What sizes are available for the Alumina substrates?
A: The typical largest size available is 280x240mm. Maximum standard thickness is 1.27mm and up to 2.0mm thicknesses are available per request. We offer customized products for special requirements.
 

Q02.What are the main advantages of a Ceramic PCB?

A: Maximum operating temperatures of the substrates of over 800°C, high Thermal Conductivity of up to 180W/mK, very low CTE (Coefficient of Thermal Expansion), 0% water absorption for Hermetic packages, low signal loss and fine microcircuit applications with the DPC production method.

Q3: What is the via diameter available for Alumina substrates?
A: Round vias with diameters of 0.2mm are available. Square holes and special shape holes are also available per request. Please contact us for details.

Q4:How are the ceramic substrates machined?
A: We use 100% laser processes. This is the best way to ensure precise and clean milling and drilling of the ceramic.

Q5: What other products do you manufacture?
A: Yes, we also produce metalized ceramics, ceramic seals and high precision pump plunger and pistons besides alumina ceramic substrates.