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Mr. Andy Chen
Technical Sales Manager

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Lapped Heat Dissipation Al2O3 Alumina Ceramic Substrates for Semiconductor Packaging pictures & photos
Lapped Heat Dissipation Al2O3 Alumina Ceramic Substrates for Semiconductor Packaging pictures & photos
Lapped Heat Dissipation Al2O3 Alumina Ceramic Substrates for Semiconductor Packaging pictures & photos
Lapped Heat Dissipation Al2O3 Alumina Ceramic Substrates for Semiconductor Packaging pictures & photos
Lapped Heat Dissipation Al2O3 Alumina Ceramic Substrates for Semiconductor Packaging pictures & photos
Lapped Heat Dissipation Al2O3 Alumina Ceramic Substrates for Semiconductor Packaging pictures & photos
  • Lapped Heat Dissipation Al2O3 Alumina Ceramic Substrates for Semiconductor Packaging
  • Lapped Heat Dissipation Al2O3 Alumina Ceramic Substrates for Semiconductor Packaging
  • Lapped Heat Dissipation Al2O3 Alumina Ceramic Substrates for Semiconductor Packaging
  • Lapped Heat Dissipation Al2O3 Alumina Ceramic Substrates for Semiconductor Packaging
  • Lapped Heat Dissipation Al2O3 Alumina Ceramic Substrates for Semiconductor Packaging
  • Lapped Heat Dissipation Al2O3 Alumina Ceramic Substrates for Semiconductor Packaging
Application: Substrate Material for Electronics Industry
Type: Ceramic Plate
Forming Method: Tape Casting
Optional Color: White, Ivory, Pink, Black
Features: High Mechanical Strength, Small Dielectric Loss
Standard Thickness: 0.25-2.0mm Available
Samples:
US$ 10/Piece 1 Piece(Min.Order)
| Request Sample
Customization:

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