Lapped Heat Dissipation Al2O3 Alumina Ceramic Substrates for Semiconductor Packaging

• Application: Substrate Material for Electronics Industry
• Type: Ceramic Plate
• Forming Method: Tape Casting
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: Customized
• Optional Color: White, Ivory, Pink, Black
• Features: High Mechanical Strength, Small Dielectric Loss
• Standard Thickness: 0.25-2.0mm Available
• Thickness Tolerance: ±0.03/0.05mm (Depending on Thickness)
• Length and Width Tolerance: ±2mm
• Customized Service: OEM, ODM, Prototyping, Trial Order
• Transport Package: Cartons with EPE Foam
• Specification: Max. up to 500mm x 500mm
• Trademark: JingHui
• Origin: China
• HS Code: 8547100000
• Production Capacity: 500000 Pieces/Month
• Package Size: 36.00cm * 20.00cm * 24.00cm
• Package Gross Weight: 5.000kg

Product Description

Lapped Heat Dissipation Al2O3 Alumina Ceramic Substrates for Semiconductor Packaging
 

Product Introduction

We are a supplier of customized alumina ceramic substrates. Our products are environmentally friendly, highly stable, corrosion-resistant, high-temperature resistant and with accurate dimensions. If you need alumina ceramic substrates, please choose Jinghui Ceramic for fast production and delivery!

Alumina ceramic is the most common substrate material you'll find in today's printed circuit boards. It boasts an excellent balance of thermal and electrical conductivity when compared to other oxide ceramic substrates.

The alumina ceramic substrate is also reputed for better mechanical strength and chemical stability and is readily available. These properties make it the ideal option for technical manufacturing, especially when various shapes have to be considered. If used in circuit boards, the purity of alumina is usually 96% or 99.6%.
 

 

Manufacturing Capacity

Below we will focus on the 96% alumina ceramic substrates. If you are interested in 99.6% alumina, please contact us to learn more.


1. Product Specification

We can produce a variety of specifications and the table below shows our standard thicknesses and sizes.
 

96% Alumina Ceramic Substrate
Thickness (mm)	Maximum Size (mm)			Shape			Molding Technique
	As Fired	Lapped	Polished	Rectangular	Square	Round
0.25	120	114.3	114.3		√		Tape Casting
0.3	120	114.3	114.3		√		Tape Casting
0.38	140×190			√			Tape Casting
0.5	140×190			√			Tape Casting
0.635	140×190			√			Tape Casting
0.76	130×140			√			Tape Casting
0.8	130×140			√			Tape Casting
0.89	130×140			√			Tape Casting
1	280×240			√			Tape Casting
1.5	165×210			√			Tape Casting
2	500×500			√			Tape Casting
Other special thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping.

2. Product Tolerances
 

96% Alumina Ceramic Substrate
Item	Substrate Thickness (mm)	Standard Tolerance (mm)	Best Tolerance (mm)	Laser Cutting Tolerance (mm)
Length and Width Tolerance	/	±2		±0.15
Thickness Tolerance	T<0.3	±0.03	±0.01
	0.30-1.0	±0.05	±0.01
	T>1.0	±10%	±0.01

3. Surface Roughness
 

96% Alumina Ceramic Substrate
Surface Roughness (μm)
As Fired	Lapped	Polished
Ra 0.2-0.75	Ra 0.3-0.7	Ra ≤0.05

4. Laser Processing

(1) Hole Size
 

96% Alumina Ceramic Substrate
Hole Diameter (mm)	Standard Tolerance (mm)
φ≤0.5	0.08
φ>0.5	0.2

(2) Laser Scribing

 

96% Alumina Ceramic Substrate
Substrate Thickness (mm)	Laser Scribe Line Depth to Thickness (%)
0.2-0.3	40%±5%
0.3<T≤0.5	50%±3%
0.5<T≤1.0	43%±3%
1.2	55%±3%
1.5	55%±3%
2.0	55%+10%
The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.

 

 

Product Parameters

96% Alumina Ceramic Substrate
Item	Unit		96% Al2O3
Mechanical Properties
Color	/	/	White
Density	Drainage Method	g/cm^3	≥3.70
Light Reflectivity	400nm/1mm	%	94
Flexural Strength	Three Point Bending	MPa	>350
Fracture Toughness	Indentation Method	MPa·m^1/2	3.0
Vickers Hardness	Load 4.9N	GPa	14
Young's Modulus	Stretching Method	GPa	340
Water Absorption		%	0
Camber	/	Length‰	T≤0.3: ≤5‰, Others: ≤3‰
Thermal Properties
Max. Service Temperature (Non-loading)	/	ºC	1200
CTE (Coefficient of Thermal Expansion)	20-800ºC	1×10^-6/ºC	7.8
Thermal Conductivity	25ºC	W/m·K	>24
Thermal Shock Resistance	800ºC	≥10 Times	No Crack
Specific Heat	25ºC	J/kg·k	750
Electrical Properties
Dielectric Constant	25ºC, 1MHz	/	9.4
Dielectric Loss Angle	25ºC, 1MHz	×10^-4	≤3
Volume Resistivity	25ºC	Ω·cm	≥10^14
Dielectric Strength	DC	KV/mm	≥15

 

Product Recommendations

Jinghui Ceramic offers bare ceramic substrates in various raw materials, sizes, shapes and thicknesses.

 

Certifications