| Application: | Laser Diode (Ld) |
|---|---|
| Finished Product: | Ceramic Circuit Board |
| Substrate Material: | Aluminium Nitride (Aln) Ceramic |
| Surface Metallization Process: | Direct Bond Copper (Dbc / Dcb) |
| Feature: | Strong Bonding Strength Between Ceramic and Metal |
| Transport Package: | Vacuum Packaging |
| Customization: |
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