| Application: | Structure Ceramic, Industrial Ceramic |
|---|---|
| Type: | Ceramic Plates |
| Finished Product: | Ceramic Circuit Board |
| Substrate Material: | 96%, 99.6% Alumina |
| Surface Metallization Process: | Mo-Mn Metallization and Ni Plating |
| Feature: | Strong Bonding Strength Between Ceramic and Metal |
| Customization: |
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