• Molybdenum-Manganese / Nickel Plating Process Alumina Ceramic Substrate with Metallization
  • Molybdenum-Manganese / Nickel Plating Process Alumina Ceramic Substrate with Metallization
  • Molybdenum-Manganese / Nickel Plating Process Alumina Ceramic Substrate with Metallization
  • Molybdenum-Manganese / Nickel Plating Process Alumina Ceramic Substrate with Metallization
  • Molybdenum-Manganese / Nickel Plating Process Alumina Ceramic Substrate with Metallization
  • Molybdenum-Manganese / Nickel Plating Process Alumina Ceramic Substrate with Metallization

Molybdenum-Manganese / Nickel Plating Process Alumina Ceramic Substrate with Metallization

Application: Structure Ceramic, Industrial Ceramic
Type: Ceramic Plates
Finished Product: Ceramic Circuit Board
Substrate Material: 96%, 99.6% Alumina
Surface Metallization Process: Mo-Mn Metallization and Ni Plating
Feature: Strong Bonding Strength Between Ceramic and Metal
Customization:
Diamond Member Since 2020

Suppliers with verified business licenses

Rating: 5.0/5
Manufacturer/Factory, Trading Company, Group Corporation
  • Overview
  • Product Introduction
  • Product Applications
  • Product Inspection
  • Our Advantages
Overview

Basic Info.

Model NO.
Customized
Usage
to Realize Electrical Connections
Material
Alumina Ceramic
Transport Package
Vacuum Packaging
Specification
According to the Drawing
Trademark
JingHui
Origin
China
HS Code
8547100000

Product Description

Molybdenum-Manganese / Nickel Plating Process Alumina Ceramic Substrate with Metallization

Product Introduction

Why Metallization is Necessary on the Surface of Ceramic Substrates?

The reliability and performance of surface metallization of ceramic substrates have an important impact on the application of ceramic substrates.

Strong bonding strength and excellent air tightness are the most basic requirements. Considering the heat dissipation of the substrate, it is also

required to have a high thermal conductivity at the interface between the metal and the ceramic.


Metallization methods on the surface of alumina ceramic substrates include: Mo-Mn method, electroless nickel plating method, silver firing method,

and Direct Bonded Copper (DBC) method.


What is Mo-Mn Method?

The Mo-Mn method, also known as the high-melting-point metal method, is based on the metallization formula of refractory metal powder Mo,

followed by a small amount of low-melting point Mn, adding a binder to coat the ceramic surface, and then sintering to form a metallized layer.


After the metallized layer is fired, in order to improve the wettability between the metallization layer and the solder, a layer of nickel needs to be

plated on it.


The following is a schematic diagram of the Mo-Mn Method of the ceramic substrate surface metallization process.

Molybdenum-Manganese / Nickel Plating Process Alumina Ceramic Substrate with Metallization

Product Applications

Molybdenum-Manganese / Nickel Plating Process Alumina Ceramic Substrate with Metallization

Product Inspection

Molybdenum-Manganese / Nickel Plating Process Alumina Ceramic Substrate with Metallization

Our Advantages

Molybdenum-Manganese / Nickel Plating Process Alumina Ceramic Substrate with Metallization

With the continuous development of smart devices in the direction of

digitalization, miniaturization, flexibility, low energy consumption, multi-

function, and high reliability, ceramic substrate metallization

technology has also received extensive attention and rapid

development.


Jinghui has rich experience in manufacturing metallized ceramic

substrates, and can carry out proofing or mass production according to

product design drawings and requirements given by users. You are

welcome to consult us for business.

 

Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now

You Might Also Like

Diamond Member Since 2020

Suppliers with verified business licenses

Rating: 5.0/5
Manufacturer/Factory, Trading Company, Group Corporation
Registered Capital
1000000 RMB
Plant Area
>2000 square meters