High-Melting-Point Metal Method Mo-Mn Technology Alumina Ceramic Circuit Board

• Application: Structure Ceramic, Industrial Ceramic
• Type: Ceramic Plates
• Finished Product: Ceramic Substrate PCB
• Substrate Material: 96%, 99.6% Alumina
• Surface Metallization Process: Mo-Mn Metallization and Ni Plating
• Feature: Strong Bonding Strength Between Ceramic and Metal
• Model NO.: Customized
• Usage: to Realize Electrical Connections
• Material: Alumina Ceramic
• Transport Package: Vacuum Packaging
• Specification: According to the Drawing
• Trademark: JingHui
• Origin: China
• HS Code: 8547100000

Product Description

High-melting-point Metal Method Mo-Mn Technology Alumina Ceramic Circuit Board

Product Introduction

What is Metallized Ceramic Substrates and Where are They Mainly Used?

The metallized ceramic substrate is a ceramic plate obtained by metallizing the surface of the ceramic substrate by technical means. The ceramic

substrate has better electrical function, thermal conductivity and insulation after metallization.


Application of Ceramic Circuit Boards:

1. LED field

2. High power semiconductor module

3. Semiconductor cooler

4. Electric heater

5. Power control circuit

6. Power hybrid circuit

7. Smart power components

8. High frequency switching power supply

9. Solid state relay

10. Automotive electronics

11. Aerospace and military electronic components

12. Solar panel modules

Production Process

What is Mo-Mn Method?

The Mo-Mn method is also called the high-melting-point metal method. It is based on the refractory metal powder Mo, and then mixes with a small

amount of low-melting-point Mn to the metallization formula, adds a binder to coat the ceramic surface, and then sinters to form a metallization layer.


Process of Molybdenum-Manganese / Nickel Plating:

1. A coating of Mo and Mn particles mixed with silicates and glass additives and volatile carriers is applied onto the ceramic surface to be brazed.

2. The coating is fired in a wet hydrogen environment at 1450-1600ºC, leaving a "glassy" metallic coating.

3. The coating is subsequently plated with a layer of Ni.

Our Advantages

Jinghui specializes in the production of metallized ceramic substrates, has rich experience in manufacturing ceramic circuit boards, and is proficient

in the surface treatment process of ceramic substrates such as Mo-Mn method (high-melting-point metal method), electroless nickel plating, silver

firing and Direct Bonded Copper (DBC).

How is Our Product Quality?

Our products have been verified by the market for many years, their reliability and stability have been unanimously recognized by customers, and

their quality has reached the leading level in the market.