Laser Scribing Ceramic PCB Alumina Substrates

Product Details
Customization: Available
Application: Refractory, Structure Ceramic, Industrial Ceramic, Functional Ceramic
Material: Alumina Ceramic
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1000000 RMB
Plant Area
20000 square meters
  • Laser Scribing Ceramic PCB Alumina Substrates
  • Laser Scribing Ceramic PCB Alumina Substrates
  • Laser Scribing Ceramic PCB Alumina Substrates
  • Laser Scribing Ceramic PCB Alumina Substrates
  • Laser Scribing Ceramic PCB Alumina Substrates
  • Laser Scribing Ceramic PCB Alumina Substrates
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  • Overview
  • Manufacturing Capacity
  • Applications
  • Product Parameters
  • Product Recommendations
  • FAQ
Overview

Basic Info.

Model NO.
JJBP-0111-0008
Forming Methods
Tape Casting
Purity of Material
96%, 99.6% Alumina
Optional Color
White, Ivory, Pink, Black
Min. Thickness
0.1mm
Max. Thickness
2.0mm
Features
High Mechanical Strength, Small Dielectric Loss
Usage
Blank Ceramic Circuit Board
Type
Ceramic Plates
Transport Package
Individual Package
Specification
Max. up to 500mm x 500mm
Trademark
JingHui
Origin
China
HS Code
8547100000

Packaging & Delivery

Package Size
36.00cm * 20.00cm * 24.00cm
Package Gross Weight
8.000kg

Product Description

Laser Processing Ceramic Substrate PCB Board Multiple Sizes Alumina Substrates

Manufacturing Capacity

The company has a strong processing capacity. We offer bare ceramic substrates in various raw materials, sizes, shapes and thicknesses. Below is the standard dimensions of our bare alumina substrates.

Alumina Ceramic Substrate
99.6% Al2O3
Thickness (mm) Maximum Size (mm) Shape Molding Technique
As Fired Lapped Polished Rectangular Square Round
0.1-0.2   50.8 50.8   Tape Casting
0.25   114.3 114.3     Tape Casting
0.38 120 114.3 114.3     Tape Casting
0.5 120 114.3 114.3     Tape Casting
0.635 120 114.3 114.3     Tape Casting
Other special thicknesses within the thickness range of 0.1-0.635mm can be achieved by lapping.
96% Al2O3
Thickness (mm) Maximum Size (mm) Shape Molding Technique
As Fired Lapped Polished Rectangular Square Round
0.25 120 114.3 114.3     Tape Casting
0.3 120 114.3 114.3     Tape Casting
0.38 140×190         Tape Casting
0.5 140×190         Tape Casting
0.635 140×190         Tape Casting
0.76 130×140         Tape Casting
0.8 130×140         Tape Casting
0.89 130×140         Tape Casting
1 280×240         Tape Casting
1.5 165×210         Tape Casting
2 500×500         Tape Casting
Other special thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping.


For products that require high dimensional accuracy, we can use various processing methods to process ceramic substrates, such as lapping, polishing, laser scribing, laser cutting, etc.

 Laser Processing

(1) Hole Size

Alumina Ceramic Substrate
Hole Diameter (mm) Standard Tolerance (mm)
φ≤0.5 0.08
φ>0.5 0.2

(2) Laser Scribing
 
Alumina Ceramic Substrate
Substrate Thickness (mm) the Percentage of
Laser Scribe Line Depth
to Thickness (%)
0.2-0.3 40%±5%
0.3<T≤0.5 50%±3%
0.5<T≤1.0 43%±3%
1.2 55%±3%
1.5 55%±3%
2.0 55%+10%
The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.

Applications

The alumina ceramic substrate has the following advantages:

1. High Wear & Chemical Resistance 2. Heat Resistant 3. High Mechanical Strength
4. Small Dielectric Loss 5. Good Thermal Conductivity 6. High Light Reflection
7. 0% Water Absorption    

The picture below shows the typical application scenarios of alumina ceramic substrates.

Laser Scribing Ceramic PCB Alumina Substrates

Product Parameters

For material properties, please refer to the table below.

Alumina Ceramic Substrate
Item Unit 96% Al2O3 99.6% Al2O3
Mechanical Properties
Color / / White Ivory
Density Drainage Method g/cm3 3.70 3.95
Light Reflectivity 400nm/1mm % 94 83
Flexural Strength Three Point Bending MPa >350 >500
Fracture Toughness Indentation Method MPa·m1/2 3.0 3.0
Vickers Hardness Load 4.9N GPa 14 16
Young's Modulus Stretching Method GPa 340 300
Water Absorption    % 0 0
Camber / Length‰ T≤0.3: 5, Others: ≤3‰ ≤3‰
Thermal Properties
Max. Service Temperature (Non-loading) / ºC 1200 1400
CTE (Coefficient of
Thermal Expansion)
20-800ºC 1×10-6/ºC 7.8 7.9
Thermal Conductivity 25ºC W/m·K >24 >29
Thermal Shock Resistance 800ºC 10 Times No Crack No Crack
Specific Heat 25ºC J/kg·k 750 780
Electrical Properties
Dielectric Constant 25ºC, 1MHz / 9.4 9.8
Dielectric Loss Angle 25ºC, 1MHz ×10-4 ≤3 ≤2
Volume Resistivity 25ºC Ω·cm 1014 1014
Dielectric Strength DC KV/mm 15 15

Product Recommendations

Beside bare ceramic substrates, we also manufacture metallized ceramic PCBs. Metallized ceramics is one of our advantageous products.

View More

Laser Scribing Ceramic PCB Alumina Substrates
Laser Scribing Ceramic PCB Alumina Substrates
Laser Scribing Ceramic PCB Alumina Substrates

FAQ

Q1: Can We Get Free Samples?
Samples of standard sizes are free, and we only charge for shipping. If customization is required, we only collect sample fee for MOQ.

Q2: How Long is the Production Lead Time?

If the product is in stock, we will ship it within 1-2 days. The standard lead time for other orders is 4-6 weeks.

Q3: What is the Depth of the Laser Scribing?
The depth of the laser scribing of our ceramic substrate is about 35%-65% of the substrate thickness. The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.

Q4: How are Ceramic Substrates Packaged to Avoid Breakage?
Because ceramics are hard and brittle materials, each of our products will be packed in a safe and reliable way to avoid damage during transportation.

Q5: Can Alumina Ceramic Substrates be Polished?
Yes, lapping and polishing will provide the desired flatness and thickness tolerance, with a surface roughness generally below Ra0.05.

If your question is not listed here, please contact us for more information.

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