Customization: | Available |
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Application: | Refractory, Structure Ceramic, Industrial Ceramic, Functional Ceramic |
Material: | Alumina Ceramic |
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The company has a strong processing capacity. We offer bare ceramic substrates in various raw materials, sizes, shapes and thicknesses. Below is the standard dimensions of our bare alumina substrates.
Alumina Ceramic Substrate | |||||||
99.6% Al2O3 | |||||||
Thickness (mm) | Maximum Size (mm) | Shape | Molding Technique | ||||
As Fired | Lapped | Polished | Rectangular | Square | Round | ||
0.1-0.2 | 50.8 | 50.8 | √ | √ | Tape Casting | ||
0.25 | 114.3 | 114.3 | √ | Tape Casting | |||
0.38 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
0.5 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
0.635 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
Other special thicknesses within the thickness range of 0.1-0.635mm can be achieved by lapping. | |||||||
96% Al2O3 | |||||||
Thickness (mm) | Maximum Size (mm) | Shape | Molding Technique | ||||
As Fired | Lapped | Polished | Rectangular | Square | Round | ||
0.25 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
0.3 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
0.38 | 140×190 | √ | Tape Casting | ||||
0.5 | 140×190 | √ | Tape Casting | ||||
0.635 | 140×190 | √ | Tape Casting | ||||
0.76 | 130×140 | √ | Tape Casting | ||||
0.8 | 130×140 | √ | Tape Casting | ||||
0.89 | 130×140 | √ | Tape Casting | ||||
1 | 280×240 | √ | Tape Casting | ||||
1.5 | 165×210 | √ | Tape Casting | ||||
2 | 500×500 | √ | Tape Casting | ||||
Other special thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping. |
For products that require high dimensional accuracy, we can use various processing methods to process ceramic substrates, such as lapping, polishing, laser scribing, laser cutting, etc.
Laser Processing
(1) Hole Size
Alumina Ceramic Substrate | |
Hole Diameter (mm) | Standard Tolerance (mm) |
φ≤0.5 | 0.08 |
φ>0.5 | 0.2 |
Alumina Ceramic Substrate | |
Substrate Thickness (mm) | the Percentage of Laser Scribe Line Depth to Thickness (%) |
0.2-0.3 | 40%±5% |
0.3<T≤0.5 | 50%±3% |
0.5<T≤1.0 | 43%±3% |
1.2 | 55%±3% |
1.5 | 55%±3% |
2.0 | 55%+10% |
The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm. |
The alumina ceramic substrate has the following advantages:
1. High Wear & Chemical Resistance | 2. Heat Resistant | 3. High Mechanical Strength |
4. Small Dielectric Loss | 5. Good Thermal Conductivity | 6. High Light Reflection |
7. 0% Water Absorption |
For material properties, please refer to the table below.
Alumina Ceramic Substrate | ||||
Item | Unit | 96% Al2O3 | 99.6% Al2O3 | |
Mechanical Properties | ||||
Color | / | / | White | Ivory |
Density | Drainage Method | g/cm3 | ≥3.70 | ≥3.95 |
Light Reflectivity | 400nm/1mm | % | 94 | 83 |
Flexural Strength | Three Point Bending | MPa | >350 | >500 |
Fracture Toughness | Indentation Method | MPa·m1/2 | 3.0 | 3.0 |
Vickers Hardness | Load 4.9N | GPa | 14 | 16 |
Young's Modulus | Stretching Method | GPa | 340 | 300 |
Water Absorption | % | 0 | 0 | |
Camber | / | Length‰ | T≤0.3: ≤5‰, Others: ≤3‰ | ≤3‰ |
Thermal Properties | ||||
Max. Service Temperature (Non-loading) | / | ºC | 1200 | 1400 |
CTE (Coefficient of Thermal Expansion) |
20-800ºC | 1×10-6/ºC | 7.8 | 7.9 |
Thermal Conductivity | 25ºC | W/m·K | >24 | >29 |
Thermal Shock Resistance | 800ºC | ≥10 Times | No Crack | No Crack |
Specific Heat | 25ºC | J/kg·k | 750 | 780 |
Electrical Properties | ||||
Dielectric Constant | 25ºC, 1MHz | / | 9.4 | 9.8 |
Dielectric Loss Angle | 25ºC, 1MHz | ×10-4 | ≤3 | ≤2 |
Volume Resistivity | 25ºC | Ω·cm | ≥1014 | ≥1014 |
Dielectric Strength | DC | KV/mm | ≥15 | ≥15 |
Beside bare ceramic substrates, we also manufacture metallized ceramic PCBs. Metallized ceramics is one of our advantageous products.
Q1: Can We Get Free Samples?
Samples of standard sizes are free, and we only charge for shipping. If customization is required, we only collect sample fee for MOQ.
Q2: How Long is the Production Lead Time?