Thick Film Laser Scribing 96% 99.6% Al2O3 Alumina Ceramic Substrate

• Application: Blank Ceramic Circuit Board
• Material: Alumina Ceramic
• Type: Wear Resistant Plate
• Forming Method: Tape Casting
• Purity of Material: 96%, 99.6% Alumina
• Features: High Mechanical Strength, Small Dielectric Loss
• Model NO.: JJBP-0111-0006
• Optional Color: White, Ivory, Pink, Black
• Density: Over 3.70g/cm3
• Standard Thickness: 0.2-2.0mm Available
• Thickness Tolerance: ±0.03/0.05mm (Depending on Thickness)
• Transport Package: Individual Package
• Specification: Max. up to 500mm x 500mm
• Trademark: JingHui
• Origin: China
• HS Code: 8547100000

Product Description

Thick Film Laser Scribing 96% 99.6% Al2O3 Alumina Ceramic Substrate
 

Product Description

About Laser Processing

The structure of the ceramic substrate is dense, but it has a certain degree of brittleness. Although it can be processed by ordinary mechanical methods, there is stress in the processing process, especially for some thin ceramic sheets, which are easily broken. Thus the processing of ceramic substrates become a difficulty, limiting the wide application of ceramic substrates.

The laser processing technology has the advantages of non-contact, flexibility, high efficiency, easy realization of digital control, and high precision. It has become one of the most ideal methods for ceramic substrate processing today.
 

The specification

Our Laser Processing Capabilities

(1) Hole Size

Alumina Ceramic Substrate
Hole Diameter (mm)	Standard Tolerance (mm)
φ≤0.5	0.08
φ>0.5	0.2

(2) Laser Scribing
 

Alumina Ceramic Substrate
Substrate Thickness (mm)	the Percentage of Laser Scribe Line Depth to Thickness (%)
0.2-0.3	40%±5%
0.3<T≤0.5	50%±3%
0.5<T≤1.0	43%±3%
1.2	55%±3%
1.5	55%±3%
2.0	55%+10%
The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.

Typical Applications

Introduction of Alumina Ceramic Substrates

Alumina (Al2O3) is one of the most widely used ceramics and the most mature ceramic substrate material because of its high mechanical strength, good insulation, high temperature resistance, good stability, high cost performance and good resistance to thermal shock.

The manufacturing and processing technology of alumina ceramic substrates are very mature. Alumina ceramic is an excellent raw material for electronic ceramic substrates, and is widely used in thick film circuits, thin film circuits, hybrid circuits, multi-chip components and high-power IGBT modules and other fields.
 

Our Regular Sizes

Alumina Ceramic Substrate
99.6% Al2O3
Thickness (mm)	Maximum Size (mm)			Shape			Molding Technique
	As Fired	Lapped	Polished	Rectangular	Square	Round
0.1-0.2		50.8	50.8		√	√	Tape Casting
0.25		114.3	114.3		√		Tape Casting
0.38	120	114.3	114.3		√		Tape Casting
0.5	120	114.3	114.3		√		Tape Casting
0.635	120	114.3	114.3		√		Tape Casting
Other special thicknesses within the thickness range of 0.1-0.635mm can be achieved by lapping.
96% Al2O3
Thickness (mm)	Maximum Size (mm)			Shape			Molding Technique
	As Fired	Lapped	Polished	Rectangular	Square	Round
0.25	120	114.3	114.3		√		Tape Casting
0.3	120	114.3	114.3		√		Tape Casting
0.38	140×190			√			Tape Casting
0.5	140×190			√			Tape Casting
0.635	140×190			√			Tape Casting
0.76	130×140			√			Tape Casting
0.8	130×140			√			Tape Casting
0.89	130×140			√			Tape Casting
1	280×240			√			Tape Casting
1.5	165×210			√			Tape Casting
2	500×500			√			Tape Casting
Other special thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping.

Product Parameters
 

Alumina Ceramic Substrate
Item	Unit		96% Al2O3	99.6% Al2O3
Mechanical Properties
Color	/	/	White	Ivory
Density	Drainage Method	g/cm^3	≥3.70	≥3.95
Light Reflectivity	400nm/1mm	%	94	83
Flexural Strength	Three Point Bending	MPa	>350	>500
Fracture Toughness	Indentation Method	MPa·m^1/2	3.0	3.0
Vickers Hardness	Load 4.9N	GPa	14	16
Young's Modulus	Stretching Method	GPa	340	300
Water Absorption		%	0	0
Camber	/	Length‰	T≤0.3: ≤5‰, Others: ≤3‰	≤3‰
Thermal Properties
Max. Service Temperature (Non-loading)	/	ºC	1200	1400
CTE (Coefficient of Thermal Expansion)	20-800ºC	1×10^-6/ºC	7.8	7.9
Thermal Conductivity	25ºC	W/m·K	>24	>29
Thermal Shock Resistance	800ºC	≥10 Times	No Crack	No Crack
Specific Heat	25ºC	J/kg·k	750	780
Electrical Properties
Dielectric Constant	25ºC, 1MHz	/	9.4	9.8
Dielectric Loss Angle	25ºC, 1MHz	×10^-4	≤3	≤2
Volume Resistivity	25ºC	Ω·cm	≥10^14	≥10^14
Dielectric Strength	DC	KV/mm	≥15	≥15

 

We also produce

 

Why choose us?

 

1. Custom sizes & thicknesses are available upon request.

2. Various processings are available (surface lapping & polishing, laser scribing & cutting, metallization, etc.).

3. Sufficient manufacturing capacity and advanced detection equipments.

4. With sufficient stock for all standard sizes, and with flexible delivery.

5. Stable quality, consistent product specifications for each batch.