Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate

Product Details
Customization: Available
Application: Electronic Devices
Function: Substrates for Ceramic Circuit Boards
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Registered Capital
1000000 RMB
Plant Area
20000 square meters
  • Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate
  • Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate
  • Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate
  • Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate
  • Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate
  • Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate
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  • Overview
  • The specification
  • Product Description
  • Typical Applications
  • We also produce
  • Certifications
  • FAQ
Overview

Basic Info.

Model NO.
Customized
Material
Alumina Ceramic
Forming Methods
Tape Casting or Dry Pressed
Optional Color
White, Ivory, Pink
Purity of Material
96%, 99.6% (Most Common)
Density
Over 3.65g/cm3
Thickness
From 0.15mm to 30mm Available
Processing Technology
Laser Scribing, Cutting, etc.
Feature
High Insulation
Type
Ceramic Substrate
Transport Package
Individual Packaging
Specification
Standard or Customized
Trademark
JingHui
Origin
China
HS Code
8547100000
Production Capacity
50000 PCS/Month

Packaging & Delivery

Package Size
27.00cm * 17.00cm * 20.00cm
Package Gross Weight
2.000kg

Product Description

Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate
The specification

1. Material: alumina ceramic

2. Dimensional capability: side length max. 400mm x 600mm; Thickness range from 0.15mm to 30mm.

3. Surface treatment: natural surface, lapping, diamond-like polishing, metallizing

4. Hole size and tolerance after laser cutting

Hole Diameter (mm) Standard Tolerance (mm)
φ≤0.5 0.08
φ>0.5 0.20

5. The scribing line specification
 
Substrate Thickness (mm) The Percentage of Laser Scribe Line Depth to Thickness (%)
0.2-0.3 40%±5%
0.3<T≤0.5 50%±3%
0.5<T≤1.0 43%±3%
1.2 55%±3%
1.5 55%±3%
2.0 55%+10%
The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-1.0mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.
Product Description

Laser scribing has been becoming the most popular machining process for electronic ceramic substrates. It offers much high efficiency and precision dimensional tolerance. The process involves pulsing a CO2 laser through an optical configuration, through a focusing lens, focusing the beam through an air assisted nozzle assembly, and finally onto the substrate's work surface. Most Laser scribing systems utilize a CNC or PC based motion control system, moving the substrate below the fixed beam assembly at speeds as fast as 10 in./sec, or faster.


Each pulse of the Laser provides an efficient and effective evacuation of molten and ablated ceramic substrate particulates. Well executed scribes allow for subsequent controlled breaks, or "Snapping", of the substrate to its final size.

Typical Applications

Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate

We also produce
Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate
Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate
Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate

 

Certifications

Laser Scribed 0.25mm 0.30mm Thick Aluminum Oxide Substrate Alumina Ceramic Al2O3 Plate

FAQ

Q01: What sizes are available for the alumina substrates?
A: The typical largest size available is 280x240mm. Maximum standard thickness is 1.27mm and up to 2.0mm thicknesses are available per request. We offer customized products for special requirements.

 

Q02: What are the main advantages of a Ceramic PCB?

A: Maximum operating temperatures of the substrates of over 800°C, high Thermal Conductivity of up to 180W/mK, very low CTE (Coefficient of Thermal Expansion), 0% water absorption for hermetic packages, low signal loss and fine microcircuit applications with the DPC production method.

Q03: What is the via diameter available for alumina substrates?
A: Round vias with diameters of 0.2mm are available. Square holes and special shape holes are also available per request. Please contact us for details.

Q04: How are the ceramic substrates machined?
A: We use 100% laser processing. It is the best way to ensure precise and clean milling and drilling of ceramics.

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