Laser Scribed 0.10mm 0.25mm 0.30mm Thick Al2O3 Alumina Ceramic Plate

• Customization: Available
• Application: Refractory, Structure Ceramic, Industrial Ceramic, Wear Resistance
• Material: Alumina Ceramic
• Model NO.: Customized
• Product Name: Alumina Ceramic Plates
• Forming Methods: Tape Casting, ISO Pressed, Dry Pressed
• Optional Color: White, Ivory, Pink
• Purity of Material: 96%, 99%, 99.5%, 99.8%
• Density: Over 3.65g/cm3
• MOQ: 10PCS Per Order
• Thickness: From 0.15mm to 30mm Available
• Normial Tolerance: Thickness to Be 0.05mm
• Precision Tolerance: Thickness to Be 0.01mm
• Flatness: Best to Be 0.005mm Via Fine Grinding
• Features: High Dielectrical, High Insulation
• Type: Ceramic Plate, Ceramic Plates
• Transport Package: Individual Packaging
• Specification: 600mm x 500mm
• Trademark: JingHui
• Origin: China
• HS Code: 8547100000
• Production Capacity: 5000000/Month

Product Description

Laser Scribed  0.10mm  0.25mm 0.30mm Thick Al2O3 Alumina Ceramic Plate

The specification

1. Material : alumina,aluminum nitride, silicon nitride and zirconia optional

2. Dimensional capability: Side length max. 400mm x 600mm, Thickness can be range from 0.10mm to 30mm

3. Surface treatment:  natural surface, lapping, diamond-like polishing, metallizing

4. Hole size and tolerance after laser cutting

Hole Diameter (mm)	Standard Tolerance (mm)
φ≤0.5	0.08
φ>0.5	0.20

5. The scribing line specification

Substrate Thickness (mm)	The Percentage of Laser Scribe Line Depth to Thickness (%)
0.2-0.3	40%±5%
0.3<T≤0.5	50%±3%
0.5<T≤1.0	43%±3%
1.2	55%±3%
1.5	55%±3%
2.0	55%+10%
The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-1.0mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.

Product Description

Laser scribing has been becoming the most popular machining process for electronic ceramic substrates,  It offers much high efficiency and precision dimensional tolerance. The process involves pulsing a CO2 laser through an optical configuration, through a focusing lens, focusing the beam through an air assisted nozzle assembly, and finally onto the substrate's work surface. Most Laser scribing systems utilize a CNC or PC based motion control system, moving the substrate below the fixed beam assembly at speeds as fast as 10 in./sec, or faster.

Each pulse of the Laser provides an efficient and effective evacuation of molten and ablated ceramic substrate particulates. Well executed scribes allow for subsequent controlled Breaks, or "Snapping", of the substrate to its final size.

Typical Applications

We also produce

Remark:
We not only produce alumina ceramic substrates, but also making both silicon ntiride(Si3N4) ceramic substrate and aluminum nitride (AlN) ceramic substrates.

Certifications

FAQ

Q01: What sizes are available for the Alumina substrates?
A: The typical largest size available is 280x240mm. Maximum standard thickness is 1.27mm and up to 2.0mm thicknesses are available per request. We offer customized products for special requirements.
 

Q02.What are the main advantages of a Ceramic PCB?

A: Maximum operating temperatures of the substrates of over 800°C, high Thermal Conductivity of up to 180W/mK, very low CTE (Coefficient of Thermal Expansion), 0% water absorption for Hermetic packages, low signal loss and fine microcircuit applications with the DPC production method.

Q03: What is the via diameter available for Alumina substrates?
A: Round vias with diameters of 0.2mm are available. Square holes and special shape holes are also available per request. Please contact us for details.

Q04:How are the ceramic substrates machined?
A: We use 100% laser processes. This is the best way to ensure precise and clean milling and drilling of the ceramic.

Q05: What other products do you manufacture?
A: Yes, we also produce metalized ceramics, ceramic seals and high precision pump plunger and pistons besides alumina ceramic substrates.