Customization: | Available |
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Application: | Electronic Devices, Lighting, Power Supply, Semiconductors |
Refractoriness (℃): | 1580< Refractoriness< 1770 |
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99.6% Al2O3 | |||||||
Thickness (mm) | Maximum Size (mm) | Shape | Molding Technique | ||||
As Fired | Lapped | Polished | Rectangular | Square | Round | ||
0.1-0.2 | 50.8 | 50.8 | √ | √ | Tape Casting | ||
0.25 | 114.3 | 114.3 | √ | Tape Casting | |||
0.38 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
0.50 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
0.635 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
Other special thicknesses within the thickness range of 0.1-0.635mm can be achieved by lapping. |
96% Al2O3 | |||||||
Thickness (mm) | Maximum Size (mm) | Shape | Molding Technique | ||||
As Fired | Lapped | Polished | Rectangular | Square | Round | ||
0.25 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
0.30 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
0.38 | 140×190 | √ | Tape Casting | ||||
0.50 | 140×190 | √ | Tape Casting | ||||
0.635 | 140×190 | √ | Tape Casting | ||||
0.76 | 130×140 | √ | Tape Casting | ||||
0.80 | 130×140 | √ | Tape Casting | ||||
0.89 | 130×140 | √ | Tape Casting | ||||
1.00 | 280×240 | √ | Tape Casting | ||||
1.50 | 165×210 | √ | Tape Casting | ||||
2.00 | 500×500 | √ | Tape Casting | ||||
Other special thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping. |
Our facility is specializing in manufacturing alumina (Aluminum oxide, Al2O3) ceramic substrate for over 14 years under rigorous quality control with carefully selected high purity ceramic materials ranging from 95% to 99.6%.
All these ceramic substrates offer extraordinary electrical, thermal and mechnical properties, especially the outstanding thermal conductivity, similar coefficient of thermal expansion thermal to Si. Furthermore, one of the unique properties is its superb surface roughness to be Ra0.2 which results in excellent adhesion strength with a thin film and thick film metallization due to fine particles, it's an ideal material for a wide range of circuit board.
The regular forming methods we use include tape-casting, isostatic pressing, dry pressing. We are dealing with a variety of selection of thicknesses from small-size to large-size capability. With our comprehensive types of manufacturing types of equipment, we have the capability from prototyping to mass production in the short term.
Specializing in the production of a wide range of bare ceramic substrates, Jinghui Industry Ltd. owns in-house comprehensive production capability, vertern engineering team and R&D experience. Our products have high cost performance and will definitely satisfy you.
Remark:
All ceramic substrates can be carried with secondary process by internal, like lapping, polishing, laser scribing, laser cutting and metallizing.