Mirror Polishing Fine Grinding Aluminum Nitride AlN Ceramic Substrate PCB
Product Introduction
Three Major Benefits of Lapping and Polishing
1. A finer pattern can be obtained.
2. Better parallelism of the upper and lower surfaces (thickness
tolerance) can be achieved.
3. A thinner metallization layer can be acquired.
Characteristics of Aluminum Nitride Ceramic Substrates
1. Great Thermal Conductivity.
2. Low Coefficient of Thermal Expansion (CTE).
3. High or Very Low Service Temperature.
4. Small Dielectric Loss.
5. High Wear & Chemical Resistance.
6. High Heat Resistance.
7. High Mechanical Strength.
8. 0% Water Absorption.
Applications
Product Parameters
| AlN Ceramic Substrate |
| Item |
Unit |
Value |
| Mechanical Properties |
| Color |
/ |
Gray |
| Density |
g/cm³ |
≥3.33 |
| Flexural Strength |
MPa |
≥380 |
| Water Absorption |
% |
0 |
| Camber |
Length‰ |
≤3‰ |
| Thermal Properties |
| Max. Service Temperature (Non-loading) |
ºC |
>1000 |
CTE (Coefficient of
Thermal Expansion) |
20-800ºC, 1×10-6/ºC |
4-6 |
| Thermal Conductivity |
20ºC, W/m·K |
170-230 |
| Electrical Properties |
| Dielectric Constant |
1MHz |
8-10 |
| Volume Resistivity |
20ºC, Ω·cm |
≥1013 |
| Dielectric Strength |
KV/mm |
≥17 |
Manufacturing Capacity
1. Product Specification
Products of various specifications can be produced. The table below shows our standard thicknesses and sizes.
| AlN Ceramic Substrate |
| Thickness (mm) |
Maximum Size (mm) |
Shape |
Molding Technique |
| As-fired |
Lapped |
Polished |
Rectangular |
Square |
Round |
| 0.1-0.2 |
|
50.8 |
50.8 |
|
√ |
√ |
Tape Casting |
| ≥0.2 |
|
114.3 |
114.3 |
|
√ |
√ |
Tape Casting |
| 0.38 |
140×190 |
140×190 |
120 |
√ |
√ |
|
Tape Casting |
| 0.5 |
140×190 |
140×190 |
120 |
√ |
√ |
|
Tape Casting |
| 0.635 |
140×190 |
200 |
200 |
√ |
√ |
√ |
Tape Casting |
| 1 |
140×190 |
300 |
200 |
√ |
√ |
√ |
Tape Casting |
| 1.5 |
|
300 |
200 |
|
√ |
√ |
Tape Casting |
| 2 |
|
300 |
200 |
|
√ |
√ |
Tape Casting |
| 2.5 |
|
300 |
|
|
√ |
√ |
Tape Casting |
| 3 |
|
300 |
|
|
√ |
√ |
Tape Casting |
| … |
|
450 |
|
|
√ |
√ |
Isostatic Pressing |
| 10 |
|
450 |
|
|
√ |
√ |
Isostatic Pressing |
| Other special thicknesses within the thickness range of 0.1-3.0mm can be achieved by lapping. |
2. Product Tolerances
| AlN Ceramic Substrate |
| Item |
Substrate Thickness (mm) |
Standard Tolerance (mm)
|
Best Tolerance (mm)
|
Laser Cutting Tolerance (mm) |
| Length and Width Tolerance |
/ |
±2 |
|
±0.15 |
| Thickness Tolerance |
T<1.0 |
±0.03 |
±0.01 |
|
| 1.0≤T<1.5 |
±0.05 |
±0.01 |
|
| T≥1.5 |
±0.07 |
±0.01 |
|
3. Surface Roughness
| AlN Ceramic Substrate |
| Material |
Surface Roughness (μm) |
| As Fired |
Lapped |
Polished |
| AIN |
Ra 0.4 |
Ra 0.3-0.7 |
Ra ≤0.05 |
4. Laser Processing
(1) Hole Size
| AlN Ceramic Substrate |
| Hole Diameter (mm) |
Standard Tolerance (mm) |
| φ≤0.5 |
0.08 |
| φ>0.5 |
0.2 |
(2) Laser Scribing
| AlN Ceramic Substrate |
| Substrate Thickness (mm) |
the Percentage of
Laser Scribe Line Depth
to Thickness (%) |
| 0.2-0.3 |
40%±5% |
| 0.5<T≤1.0 |
50%±3% |
| 1.0<T≤1.2 |
55%±3% |
| 1.2<T≤1.5 |
60%±3% |
| 2.0 |
45% (Extreme Depth) |
| The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm. |
Packaging & Shipping
Because ceramics are hard and brittle materials, each of our products will be packed in a safe and reliable way to avoid damage during transportation.
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