Mirror Polishing Fine Grinding Aluminum Nitride Aln Ceramic Substrate PCB

• Customization: Available
• Application: Electronic Devices, Lighting, Power Supply, Semiconductors, Bare Ceramic Circuit Board
• Dielectric: Ain
• Model NO.: JJBP-0141-0014
• Structure: Ceramic Base PCB
• Material: Aluminum Nitride Ceramic
• Base Material: Aluminum Nitride Ceramic
• Insulation Materials: Aluminum Nitride Ceramic
• Forming Method: Tape Casting
• Features: High Thermal Conductivity, Cte Matching Si
• Density: Over 3.33G/Cm3
• Standard Thickness: 0.1-3mm Available
• Thickness Tolerance: ±0.03/0.05mm (Depending on Thickness)
• Length and Width Tolerance: ±2mm
• Customized Service: OEM, ODM, Prototyping, Trial Order Supported
• Transport Package: Individual Package
• Specification: Max. Side Length or Diameter 300mm
• Trademark: JingHui
• Origin: China
• HS Code: 8547100000

Product Description

Mirror Polishing Fine Grinding Aluminum Nitride AlN Ceramic Substrate PCB

Product Introduction

 

Three Major Benefits of Lapping and Polishing

1. A finer pattern can be obtained.

2. Better parallelism of the upper and lower surfaces (thickness

tolerance) can be achieved.

3. A thinner metallization layer can be acquired.


Characteristics of Aluminum Nitride Ceramic Substrates

1. Great Thermal Conductivity.

2. Low Coefficient of Thermal Expansion (CTE).

3. High or Very Low Service Temperature.

4. Small Dielectric Loss.

5. High Wear & Chemical Resistance.

6. High Heat Resistance.

7. High Mechanical Strength.

8. 0% Water Absorption.
 

Applications

Product Parameters

AlN Ceramic Substrate
Item	Unit	Value
Mechanical Properties
Color	/	Gray
Density	g/cm³	≥3.33
Flexural Strength	MPa	≥380
Water Absorption	%	0
Camber	Length‰	≤3‰
Thermal Properties
Max. Service Temperature (Non-loading)	ºC	>1000
CTE (Coefficient of Thermal Expansion)	20-800ºC, 1×10^-6/ºC	4-6
Thermal Conductivity	20ºC, W/m·K	170-230
Electrical Properties
Dielectric Constant	1MHz	8-10
Volume Resistivity	20ºC, Ω·cm	≥10^13
Dielectric Strength	KV/mm	≥17

Manufacturing Capacity

1. Product Specification

Products of various specifications can be produced. The table below shows our standard thicknesses and sizes.

AlN Ceramic Substrate
Thickness (mm)	Maximum Size (mm)			Shape			Molding Technique
	As-fired	Lapped	Polished	Rectangular	Square	Round
0.1-0.2		50.8	50.8		√	√	Tape Casting
≥0.2		114.3	114.3		√	√	Tape Casting
0.38	140×190	140×190	120	√	√		Tape Casting
0.5	140×190	140×190	120	√	√		Tape Casting
0.635	140×190	200	200	√	√	√	Tape Casting
1	140×190	300	200	√	√	√	Tape Casting
1.5		300	200		√	√	Tape Casting
2		300	200		√	√	Tape Casting
2.5		300			√	√	Tape Casting
3		300			√	√	Tape Casting
…		450			√	√	Isostatic Pressing
10		450			√	√	Isostatic Pressing
Other special thicknesses within the thickness range of 0.1-3.0mm can be achieved by lapping.

2. Product Tolerances
 

AlN Ceramic Substrate
Item	Substrate Thickness (mm)	Standard Tolerance (mm)	Best Tolerance (mm)	Laser Cutting Tolerance (mm)
Length and Width Tolerance	/	±2		±0.15
Thickness Tolerance	T<1.0	±0.03	±0.01
	1.0≤T<1.5	±0.05	±0.01
	T≥1.5	±0.07	±0.01

3. Surface Roughness
 

AlN Ceramic Substrate
Material	Surface Roughness (μm)
	As Fired	Lapped	Polished
AIN	Ra 0.4	Ra 0.3-0.7	Ra ≤0.05

4. Laser Processing

(1) Hole Size
 

AlN Ceramic Substrate
Hole Diameter (mm)	Standard Tolerance (mm)
φ≤0.5	0.08
φ>0.5	0.2

(2) Laser Scribing
 

AlN Ceramic Substrate
Substrate Thickness (mm)	the Percentage of Laser Scribe Line Depth to Thickness (%)
0.2-0.3	40%±5%
0.5<T≤1.0	50%±3%
1.0<T≤1.2	55%±3%
1.2<T≤1.5	60%±3%
2.0	45% (Extreme Depth)
The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm.

Packaging & Shipping

Because ceramics are hard and brittle materials, each of our products will be packed in a safe and reliable way to avoid damage during transportation.