Big Size Zirconia Circuit Board Zro2 Wafer Zirconium Oxide Substrate

Product Details
Customization: Available
Application: Electronic Devices, Lighting, Power Supply, Semiconductors
Thickness: Customized
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Registered Capital
1000000 RMB
Plant Area
20000 square meters
  • Big Size Zirconia Circuit Board Zro2 Wafer Zirconium Oxide Substrate
  • Big Size Zirconia Circuit Board Zro2 Wafer Zirconium Oxide Substrate
  • Big Size Zirconia Circuit Board Zro2 Wafer Zirconium Oxide Substrate
  • Big Size Zirconia Circuit Board Zro2 Wafer Zirconium Oxide Substrate
  • Big Size Zirconia Circuit Board Zro2 Wafer Zirconium Oxide Substrate
  • Big Size Zirconia Circuit Board Zro2 Wafer Zirconium Oxide Substrate
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Basic Info.

Model NO.
JJBP-0121-0020
Dielectric
Zirconia Ceramic
Forming Method
Tape Casting
Features
High Flexural Strength and Wear Resistance
Usage
Blank Ceramic Circuit Board
Optional Color
White, Yellow, Black, Blue
Density
Over 6.0g/cm3
Flexural Strength
>800MPa
Dielectric Constant
33MHz
Dielectric Loss Angle
≦16MHz
Customized Service
OEM, ODM, Prototyping, Trial Order Supported
Transport Package
Individual Package
Specification
Standard or Customized
Trademark
JingHui
Origin
China
HS Code
8547100000

Packaging & Delivery

Package Size
36.00cm * 20.00cm * 24.00cm
Package Gross Weight
8.000kg

Product Description

Big Size Zirconia Circuit Board ZrO2 Wafer Zirconium Oxide Substrate

 Introduction of Zirconia Ceramic Substrates
 
Zirconia ceramics have high toughness, high flexural strength, high

wear resistance, excellent thermal insulation properties and the

thermal expansion coefficient close to that of steel.



Advantages of Zirconia ceramic substrates


1. Strong mechanical properties.

2. High temperature resistance.

3. Corrosion resistance.

4. Low thermal conductivity.

5. High insulation.
Big Size Zirconia Circuit Board Zro2 Wafer Zirconium Oxide Substrate

Molding Technique of Zirconia Ceramic Substrates

At present, injection molding, dry pressing and tape casting are usually used to pruduce zirconia ceramic substrates.

1. Injection molding is only suitable for forming thick substrates with thicknesses more than 1mm.

2. Dry pressing often causes delamination of the green body due to uneven radial and axial pressure distribution during the molding process.

3. Tape casting is suitable for producing thin ceramic substrates with thicknesses from 0.2mm to 3mm. The have the advantages of fast production

speed, high degree of automation, uniform structure and good product quality.

The molding process used for our zirconia ceramic substrates is tape casting.  Below is the process flow.

Big Size Zirconia Circuit Board Zro2 Wafer Zirconium Oxide Substrate

Material Properties of Zirconia Ceramic Substrates
 
Zirconia Ceramic Substrate
Item Unit ZrO2
Mechanical Properties
Color / White
Density g/cm3 ≥6
Water Absorption % 0
Vickers Hardness (Load 4.9N) Gpa 11
Young's Modulus GPa 200
Flexural Strength Mpa >800
Fracture Toughness MPa·m1/2 5.0
Thermal Properties
Max. Service Temperature (Non-loading) ºC 1000
CTE (Coefficient of Thermal Expansion) (20-800ºC) 10-6/ºC 7.8
Thermal Shock Resistance 10 Times No Crack
Thermal Conductivity (25ºC) W/m·K >3
Specific Heat (25ºC) J/kg·K 460
Electrical Properties
Volume Resistivity (25ºC) Ω·cm ≥1013
Dielectric Strength KV/mm ≥10
Dielectric Constant (25ºC, 1MHz ) (E) 33
Dielectric Loss Angle (25ºC, 1MHz ) ×10-4 ≤16

Why Choose Us?

The company has a strong processing capacity. We offer bare ceramic substrates in various raw materials, sizes, shapes and thicknesses. Contact

us today with your specifications.

Big Size Zirconia Circuit Board Zro2 Wafer Zirconium Oxide Substrate

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