Customization: | Available |
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Application: | Electronic Devices, Lighting, Power Supply, Semiconductors, Refractory, Structure Ceramic, Industrial Ceramic |
Material: | Al2O3 |
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About the Thickness
The thicker the alumina ceramic substrate, the better the strength and the stronger the pressure resistance, but the thermal conductivity is worse than that of the thinner one.
On the contrary, the thinner the substrate, the weaker the strength and pressure resistance than the thicker one, but the thermal conductivity is stronger.
Product Specification
Products of various specifications can be produced. The table below shows our standard thicknesses and sizes.
Alumina Ceramic Substrate | |||||||
99.6% Al2O3 | |||||||
Thickness (mm) | Maximum Size (mm) | Shape | Molding Technique | ||||
As Fired | Lapped | Polished | Rectangular | Square | Round | ||
0.1-0.2 | 50.8 | 50.8 | √ | √ | Tape Casting | ||
0.25 | 114.3 | 114.3 | √ | Tape Casting | |||
0.38 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
0.5 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
0.635 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
Other special thicknesses within the thickness range of 0.1-0.635mm can be achieved by lapping. | |||||||
96% Al2O3 | |||||||
Thickness (mm) | Maximum Size (mm) | Shape | Molding Technique | ||||
As Fired | Lapped | Polished | Rectangular | Square | Round | ||
0.25 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
0.3 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
0.38 | 140×190 | √ | Tape Casting | ||||
0.5 | 140×190 | √ | Tape Casting | ||||
0.635 | 140×190 | √ | Tape Casting | ||||
0.76 | 130×140 | √ | Tape Casting | ||||
0.8 | 130×140 | √ | Tape Casting | ||||
0.89 | 130×140 | √ | Tape Casting | ||||
1 | 280×240 | √ | Tape Casting | ||||
1.5 | 165×210 | √ | Tape Casting | ||||
2 | 500×500 | √ | Tape Casting | ||||
Other special thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping. |
Product Parameters
Alumina Ceramic Substrate | ||||
Item | Unit | 96% Al2O3 | 99.6% Al2O3 | |
Mechanical Properties | ||||
Color | / | / | White | Ivory |
Density | Drainage Method | g/cm3 | ≥3.70 | ≥3.95 |
Light Reflectivity | 400nm/1mm | % | 94 | 83 |
Flexural Strength | Three Point Bending | MPa | >350 | >500 |
Fracture Toughness | Indentation Method | MPa·m1/2 | 3.0 | 3.0 |
Vickers Hardness | Load 4.9N | GPa | 14 | 16 |
Young's Modulus | Stretching Method | GPa | 340 | 300 |
Water Absorption | % | 0 | 0 | |
Camber | / | Length‰ | T≤0.3: ≤5‰, Others: ≤3‰ | ≤3‰ |
Thermal Properties | ||||
Max. Service Temperature (Non-loading) | / | ºC | 1200 | 1400 |
CTE (Coefficient of Thermal Expansion) |
20-800ºC | 1×10-6/ºC | 7.8 | 7.9 |
Thermal Conductivity | 25ºC | W/m·K | >24 | >29 |
Thermal Shock Resistance | 800ºC | ≥10 Times | No Crack | No Crack |
Specific Heat | 25ºC | J/kg·k | 750 | 780 |
Electrical Properties | ||||
Dielectric Constant | 25ºC, 1MHz | / | 9.4 | 9.8 |
Dielectric Loss Angle | 25ºC, 1MHz | ×10-4 | ≤3 | ≤2 |
Volume Resistivity | 25ºC | Ω·cm | ≥1014 | ≥1014 |
Beside bare ceramic substrates, we also manufacture metallized ceramic PCBs. Metallized ceramics is one of our advantageous products.